In our daily life, heat conduction is an indispensable phenomenon, and thermal contact conductance is one of the important parameters in this phenomenon. It describes how heat is transferred between two solid or liquid objects when they are in contact. Thermal contact conductance is at work everywhere, whether we turn on an electronic device or boil water in a pot.
Thermal contact conductance is the inherent mechanism of heat transfer, affecting the flow of heat between different materials.
When two solid objects are in contact, heat flows from the hotter object to the cooler object. During this process, there will be an obvious temperature drop at the contact interface, which is the resistance of thermal contact conductivity. This phenomenon is called thermal contact resistance, which is the ratio of the temperature drop across the interface to the average heat flow.
Thermal contact conductance is critical in a variety of applications, especially those physical systems involving the mechanical bonding of two dissimilar materials. For example, in electronics, thermal contact conductance affects the effectiveness of the heat sink, which is critical for dissipating heat. In addition, thermal contact conductance also plays a central role in nuclear reactor cooling systems and internal combustion engines.
Thermal contact conductance is a key parameter for heat dissipation in electronic devices, affecting the overall performance.
Thermal contact conductance is a complex phenomenon that is affected by many factors. Among these factors, contact pressure, interface material, surface roughness and cleanliness are the main influencing factors. The greater the contact pressure, the larger the contact area, resulting in increased contact conductance. Surface imperfections increase resistance to heat flow because heat transfer can only occur between limited contact points.
The effect of contact pressure on heat transfer is obvious. As pressure increases, the actual contact area also increases, which helps reduce contact resistance and allows for smoother heat flow.
When there is a solid gas or liquid filling between two contacting objects, the thermal conductivity of these materials will also affect the performance of thermal contact conductivity. For example, gases or liquids have low thermal conductivity, which increases the resistance to overall heat transfer.
Surface roughness, waviness, and smoothness all affect the thermal conductivity of the contact interface. Irregular surfaces prevent heat from being transferred effectively between materials, so surface treatment is also a key consideration when designing materials.
When dust or dirt is present on the contact surfaces, these impurities affect the thermal contact conductance. Therefore, keeping the contact surfaces clean is essential to ensure good heat transfer performance.
Determining the thermal contact conductance requires experimental methods or measurement results using advanced equipment. The accumulation of these data is very important for advancing technological development. Research results in this area can usually be found in professional journals, but a complete database of thermal contact conductance has not yet been established, which sometimes leads to incorrect design choices.
In addition to thermal contact conductance, there is also a concept called thermal interface conductance. Even at an ideal contact interface, some conductance will still exist due to differences in the electronic and vibrational properties of the materials. Therefore, thermal interface conductance may be more important for nanoscale material systems.
As our understanding of thermal contact conductivity improves, new insights are emerging into how to improve the transfer and management of energy. In the future, can we explore the potential of thermal contact conductivity in a wider range of technological applications to improve our quality of life?