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From PGA to BGA: What's behind this evolution of packaging technology?!
With the development of science and technology, the packaging technology of electronic components is also constantly evolving. Many modern electronic devices use BGA (ball grid array) packaging, and this new packaging technology actually originated from PGA (pin grid array). In this article, we will explore the birth of BGA, its advantages and disadvantages, and its role in today's electronics industry.
Overview of BGA
BGA is a surface mount package used for fixed installation of integrated circuits, especially microprocessors. Compared with traditional dual in-line package (DIP) or planar package, BGA can provide a larger connection pin count because the entire surface of its bottom is available for placement of solder balls, and the distance between solder balls is shorter, which is Improves performance during high-speed operation.
BGA packaging technology allows electronic components to have higher connection density, which solves the difficulties caused by traditional packaging.
The welding of BGA usually requires precise control. This process is mostly completed through a computer-controlled automatic remelting furnace to ensure the stability of the welding quality. The BGA package mainly consists of a plastic or ceramic substrate with a solder ball on the bottom, which corresponds to the copper pad of the PCB. After heating, the solder ball will melt and connect with the copper pad of the PCB.
Evolution from PGA to BGA
PGA is a package with pins on the bottom. These pins are usually distributed in a grid and are used to connect the integrated circuit to the printed circuit board (PCB). However, with the miniaturization of electronic components and the increase in the number of required pins, the design of PGA becomes increasingly overwhelmed. The resulting BGA design not only solves the welding difficulties caused by the increased number and spacing of pins, but also improves the signal transmission performance during the welding process.
BGA technology successfully integrates the advantages of high-density connections, high thermal conductivity and low inductance, becoming an important milestone in the electronics industry.
Advantages of BGA
High Density
One of the biggest advantages of BGA is its high density. This form of packaging can concentrate up to hundreds of pins in a small area, solving the problem of difficult soldering caused by shrinking pin spacing. The configuration of BGA makes the transmission of signals more efficient, especially in high-speed circuits.
Heat conduction
Another significant advantage is BGA's thermal conductivity. Compared with packages with individual pins, BGAs have lower thermal resistance, which allows the heat generated by the integrated circuit during operation to be dissipated more efficiently, thereby reducing the risk of overheating.
Low inductance leads
Since the distance between the BGA's solder balls and the PCB is very short, this avoids unnecessary inductance under high-frequency operation. Therefore, the electrical performance of BGA is better than that of traditional pin packaging, especially in high-speed electronic applications.
Challenges of BGA
Lack of flexibility
One disadvantage of BGA is that its solder balls are not as flexible as longer pins, so a thermal expansion mismatch between the PCB and BGA can cause the solder joint to break. To improve this shortcoming, it is usually necessary to use an "underfill" process to enhance the resistance of welding.
Check difficulty
Once the BGA is soldered in place, it becomes difficult to check the soldering quality. In order to solve this problem, the industry has developed advanced inspection technologies such as X-ray machines and industrial CT scanners. However, such technology is often costly, so electrical testing methods are preferred.
Challenges in the development process
During the circuit development stage, plugs are often used for temporary connections due to the challenges of BGA soldering, but these plugs tend to have poor reliability.
Equipment cost
Reliably soldering BGA packages requires expensive equipment, and the reliability of manual soldering is relatively low. Against this background, DIY repair technology gradually emerged, and many enthusiasts began to try to use simple heat sources for resoldering.
Variant of BGA
BGA has spawned many variations, examples of which include flip-chip technology, which enables soldering at a microscopic level. With each new package, the capabilities and application range of electronic components continue to expand.
Future development trends
Research and technological innovation around BGAs continue to advance, especially in dealing with extreme working conditions and adapting to the characteristics of different materials. In order to adapt to the increasingly harsh use environment, developers are constantly seeking more reliable welding technologies and materials.
For future electronic products, whether BGA can continue to lead and meet market demand is a question worth pondering.
