Evaluation of stress intensity factors under thermal effect employing domain integral method and ordinary state based peridynamic theory

Abstract

In this article, several thermoelastic benchmark cases are studied within the framework of ordinary state based peridynamic theory (OSPD). By using OSPD, the limitations of geometrical discontinuity in fracture analysis can be overcome. Meanwhile, double nodes can also be avoided during crack definition. A domain integral method with thermal effect is applied in calculating the thermal stress intensity factors (TSIFs). Meanwhile, peridynamic differential operators are utilized to rewrite the spatial derivatives in the domain integral. Numerical investigations of TSIFs in the single and mixed-mode crack scenarios are provided respectively, and verified by the reference solutions. Good agreements between OSPD and the reference solutions show high performance and capability of the proposed method in thermoelastic fracture analysis.