Review on laser-induced etching processing technology for transparent hard and brittle materials

Abstract

The high-efficiency processing and the high geometrical precision requirements on the transparent hard-brittle optoelectrical materials are attractive to the modern industrial’s interest. Laser-induced related ablation/etching technology is proved to be effective processing for micro/nanofabrication of the transparent hard and brittle materials, due to its unique advantages of mechanical micro-machining with controllable thermal damage. There are some influencing factors like laser duration, target-to-substrate distance (work distance), target materials (absorption resolution), laser fluence, and circumstance (pressure, air, resolution) which were discussed in this review. The processing qualities in various methods were compared and described in this review. The new development of laser-induced related ablation/etching and related advanced technologies is introduced at the end of this review.