Transactions on Electrical and Electronic Materials | 2021
Magnetothermal behavior of a planar coil
Abstract
The world of microelectronics is punctuated by the permanent race for integration, in order to be able to reduce the sizes, costs and power consumption of products. The largest discrete components which are seek today are passive elements, present in an increasingly important proportion. In circuits (resistors, inductors and capacitors). The scientific research aimed at highlighting the magnetothermal behavior of this type of component shows a certain deficit. In this regard, this paper presents an investigation by way of numerical simulation of the magnetothermic behavior, allowing the enhancement of the design of a square planar coil sandwiched between two magnetic materials. It is intended to be inserted in a micro-converter of Buck type. The phenomenon studied is governed by Maxwell s equations coupled with the heat equation, which are solved by the finite element method. The heat transfer processes by conduction and by convection are taken into account in steady state. Gap effects are considered as a control parameter on the magnetic, electrical and thermal behaviours, in order to determine it’s the optimal value allowing to have the best inductor operation while having an optimum cooling ratio. The materials composing this structure do not react in the same way to temperature variations, which will generate stresses in the materials that compose it and render it non-functional. The numerical simulation results show the distribution of the magnetic field, the role of the different materials constituting the substrate and the temperature distribution. On the other hand, they made it possible to optimize the gap value, which is considered as an important parameter during the dimensioning of the microcoil to determine the optimal geometric parameters.