Novel Cu-Ag composite nanoparticle paste for low temperature bonding

Abstract

Abstract To solve the problems of high bonding temperature and spontaneous oxidation of Cu nanoparticles, a novel Cu-Ag composite nanoparticle paste was developed and demonstrated for low temperature bonding. The composite nanoparticles have small particle size (9\u202fnm) and good oxidation resistance. The effect of bonding temperature on the mechanical properties and microstructure evolutions of bonded joints was investigated. The Cu Cu bonded joints exhibit high shear strength of 18.9\u202fMPa at a low bonding temperature of 225\u202f°C, and the fracture microstructures exhibit significant ductile deformations, which are attributed to the sufficient sintering of nanoparticles. The results demonstrate that the Cu-Ag composite nanoparticle paste is a promising die attach material for low temperature bonding.