A wavelet-based multi-dimensional temporal recurrent neural network for stencil printing performance prediction

Abstract

Abstract The solder paste printing (SPP) is a critical procedure in a surface mount technology (SMT) based assembly line, which is one of the major attributes to the defect of the printed circuit boards (PCBs). The quality of SPP is influenced by multiple factors, such as the squeegee speed, pressure, the stencil separation speed, cleaning frequency, and cleaning profile. During printing, the printer environment is dynamically varying due to the physical change of solder paste, which can result in a dynamic variation of the relationships between the printing results and the influential factors. To reduce the printing defects, it is critical to understand such dynamic relationships. This research focuses on determining the printing performance during printing by implementing a wavelet filtering-based temporal recurrent neural network. To reduce the noise factor in the solder paste inspection (SPI) data, this research applies a three-dimensional dual-tree complex wavelet transformation for low-pass noise filtering and signal reconstruction. A recurrent neural network is utilized to model the performance prediction with low noise interference. Both printing sequence and process setting information are considered in the proposed recurrent network model. The proposed approach is validated using practical dataset and compared with other commonly used data mining approaches. The results show that the proposed wavelet-based multi-dimensional temporal recurrent neural network can effectively predict the printing process performance and can be a high potential approach in reducing the defects and controlling cleaning frequency. The proposed model is expected to advance the current research in the application of smart manufacturing in surface mount technology.