Electrophoretic deposition of binder-free TiN nanoparticles to design 3D microstructures. The role of sintering in the microstructural robustness of supercapacitor electrodes

Abstract

Abstract TiN is herein used as an example to elucidate that a sintering treatment should be considered as a relevant variable to discuss charge storage mechanisms, charge transfer resistances and others important electrochemical aspects of the non-oxidic supercapacitor electrodes. Binder-free TiN nanocoatings with low charge transfer resistance ( NPs) suspensions. FESEM and electrochemical results confirm that TiN NPs full-cover the 3D foams and the first layers, in direct contact with the substrate, consolidate during the EPD process due to the elevated voltage applied to the on growing layer.