5G Transceiver Component Cell-packing Fabrication for Wireless Data Transmission Using LTCC Technology

Abstract

As an attractive electronic component fabrication method, LTCC technology has been widely used for the creation of highly integrated components in advanced manufacturing field. In this paper, a fabrication method of 5G transceiver component cell-packing was presented using LTCC technology. RF and capacitor chips were also bonded to the cell-packing for electrical performance test. The experimental results showed that the actual dimensions of cell-packing had little differences from the design dimensions, and the cell-packing coating had good solderability. Through electrical performance test, the core electrical performance indicators of 5G transceiver component, such as signal gain and output power, were reasonable over the whole operating frequency band. It indicated that the cell-packing can be applied to 5G transceiver component in satellite communications for wireless data transmission.