Reliability Parameter Optimization of Electromagnetic Relay for Aerospace Products Based on 3D Thermal Stress Field

Abstract

The reliability of thermal and solid coupling relay is an important factor in aerospace products. A refined model based on the internal constitutive characteristics of the device is established, and the thermal solid coupling relationship curve is established. The three-dimensional temperature field and thermal stress field are analyzed by using the finite element analysis software ANSYS. Through the simulation of the thermal field and thermal stress field under different parameters, the design factors affecting the internal thermal distribution of the device are preliminarily analyzed, which provides the parameter basis for the reliability optimization design of the relay.