Advanced 3D Design Technology Co-Optimization for Manufacturability

Abstract

Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. It is a continuous challenge to meet targets of both yield and cost, due to new device structures and the increasing complexity of process innovations introduced to achieve improved product performance at each technology node. Design for manufacturability (DFM) and design technology co-optimization (DTCO) are widely used to ensure successful delivery of both new processes and products in semiconductor manufacturing. In this paper, we develop a new 3D DTCO model which combines 3D structure optimization and electrical analysis. We discuss how this 3D DTCO model can be used to improve product yield and accelerate product delivery timelines in semiconductor manufacturing.