Advanced 2.5D Heterogeneous Integrated Platform Using Flexible Biocompatible Substrate for Biomedical Sensing System

Abstract

In this work, a novel biocompatible flexible heterogeneous integration platform has been developed. Using thermal compression bonding and conductive adhesive, three different functional devices, including sensing array, analog front-end chip, and LED array, are integrated on the flexible biocompatible substrate. Moreover, the whole exposed area of the platform is designed to be processed with biocompatible material. Thus, this structure is a promising integration scheme for the biomedical applications. Bending tests and reliability tests have been also performed to validate the feasibility of this flexible heterogeneous integration platform.