2019 IEEE 69th Electronic Components and Technology Conference (ECTC) | 2019

Novel Multicore PCB and Substrate Solutions for Ultra Broadband Dual Polarized Antennas for 5G Millimeter Wave Covering 28GHz & 39GHz Range

 
 
 
 
 

Abstract


5G millimeter wave (mmWave) communications that enables Gbps data channels often require broadband operation with dual polarization in multi frequency ranges (27-30, and 37-40GHz). Additionally, access points and base stations need large high gain antenna arrays and consistent radiation patterns across operation frequencies for ease of beam scanning control. Many stacked patch antennas were proposed as the solution. However, broadband patch antennas require thick substrate and multiple layers. For high volume production in standard substrate technology with acceptable yield, such solution targeting the consumer market has not been attempted previously. In this work, we present a novel multicore packaging approach to realize a unique and cost effective solution based on standard PCB/ Substrate technology. We demonstrate this with a complete mmWave RF module board with dimensions of 30mm x 50mm x 1.5mm. It consists of a large area dual polarization dual frequency (28GHz and 39GHz) stacked patch antenna array of 4x8 elements and fully integrated Systems-In-Package (SIPs) along with all the thermal and mechanical functions. This solution achieves a very high cross polarization discrimination ratio (>25dB), which is critical in the MIMO operation of the dual polarization network. The work includes measurements to validate the design and the packaging concept suitable for low cost mmWave 5G CPE (Customer Premises Equipment) and base station applications.

Volume None
Pages 954-959
DOI 10.1109/ECTC.2019.00149
Language English
Journal 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

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