Advance Embedded Packaging for Power Discrete Device

Abstract

Power devices are developing towards high performance, small size, modularization and integration. These devices need not only high thermal performance, but also complex circuit layout. However, power devices of traditional wiring technology are unable to meet the requirements. In order to solve this problem, a new kind of advanced and extensible power package device is developed by the embedded packaging technology, which utilizes porous heat dissipation and conduction, with low resistance and good thermal performance. The reliability of power devices after moisture adsorption and reflow soldering is a key problem to be overcome in project development. In order to verify the problem, DFN5×6 embedded package is used to replace the traditional lead package test, which uses finite element software to build the three-dimensional model as to analyze the distribution of relative moisture and thermal stress in embedded package during re-welding. According to the size of the simulation model to manufacture the experimental products, which proves that there s no product failed after verifying MSL3 through the electrical property test. This packaging method has excellent low resistance property and will be more and more used in power devices.