2019 IEEE International Electron Devices Meeting (IEDM) | 2019
Addressing reliability challenges in advance nodes for commercial and automotive application
Abstract
Building in reliability is critical during technology development, as we continue scaling or incorporating additional functionality. In this paper Front End Of Line methodologies (FEOL) for DC and AC degradation with correlation to RO/SRAM/Logic degradation are presented. Self-Heating and Variability characterization together with inline monitoring are discussed for commercial and automotive applications.