2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) | 2019

Leakage Current Degradation in SiC Junction Barrier Schottky Diodes under Heavy Ion Microbeam

 
 
 
 
 
 
 

Abstract


Leakage current degradation of SiC junction barrier Schottky diodes were studied under heavy ion microbeam. Leakage current increased linearly with fluence and was positively related to bias voltage. It was proposed that leakage current occurred as a result of the accumulation of multiple leakage paths. The explanation that the increased leakage current was related to leakage paths formed by damage in the mechanism of micro-SEB was verified.

Volume None
Pages 1-4
DOI 10.1109/IPFA47161.2019.8984872
Language English
Journal 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)

Full Text