Optimizing Quality Inspection and Control in Powder Bed Metal Additive Manufacturing: Challenges and Research Directions

Abstract

One of the key targets of Industry 4.0 and digital production, in general, is the support of faster, cleaner, and increasingly customizable manufacturing processes. Additive manufacturing (AM) is a natural fit in this context, as it offers the possibility to produce complex parts without the design constraints of traditional manufacturing routes, typically reducing both material waste and time to market. Nonetheless, the lack of repeatability of the manufacturing process, which typically translates into a lack of reproducibility and reliability of the quality of the final products compared to traditional subtractive technologies, is currently one of the major barriers to the widespread adoption of AM in mass production. To overcome this limitation, there are growing efforts in recent years toward better integration of advanced information technologies into AM, exploiting the layer-by-layer nature of the build. The consequence of these efforts is twofold: 1) the integration of advanced sensing technologies into the AM systems, making possible the in situ monitoring of huge amounts of data at multiple time scales and resolutions and 2) the ever-increasing role of data-driven approaches [especially machine learning (ML)] in the analysis of such data to provide real-time quality monitoring and process optimization. This article introduces and reviews the key technological developments of this phenomenon, with a special focus on metal powder bed fusion (PBF) technologies that are attracting the highest attention by the industrial AM community. After introducing the main manufacturing quality issues and needs that have to be developed and optimized, we provide a wide overview of the latest progress of in situ monitoring and control in metal PBF, with special regards to sensing technologies and ML approaches. Finally, we identify the open challenges and future research directions in this field.