IEEE Transactions on Components, Packaging and Manufacturing Technology | 2019

Design of an Area-Scalable Two-Layer Evaporator Wick for High-Heat-Flux Vapor Chambers

 
 
 

Abstract


A hybrid two-layer evaporator wick is proposed for passive, high-heat-flux dissipation over large areas using a vapor chamber heat spreader. For such applications, the evaporator wick layer must be designed to simultaneously minimize the device temperature rise and minimize the flow resistance to a capillary feeding of the wick. This requires a strategy that exploits the benefits of a thin wick for reduced thermal resistance and a thick wick for liquid feeding. In the present design, a thick cap layer of wick material evenly routes liquid to a thin, low-thermal-resistance base layer through an array of vertical liquid-feeding posts. This two-layer structure decouples the functions of liquid resupply (cap layer) and capillary-fed boiling heat transfer (base layer), making the design scalable to heat input areas of ~1 cm2 for operation at 1 kW/cm2. A reduced-order model is developed to demonstrate the potential performance of a vapor chamber incorporating such a two-layer evaporator wick design. The model comprises simplified hydraulic and thermal resistance networks for predicting the capillary-limited maximum heat flux and the overall thermal resistance, respectively. The reduced-order model is validated against a higher fidelity numerical model and then used to analyze the performance of the vapor chamber with varying two-layer wick geometric feature sizes. The two-layer wick design is found to sustain liquid feeding at higher heat fluxes, without reaching the capillary limit, compared to single-layer evaporator wick designs.

Volume 9
Pages 458-472
DOI 10.1109/TCPMT.2018.2860961
Language English
Journal IEEE Transactions on Components, Packaging and Manufacturing Technology

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