Modeling for assessing Semiconductor Packages in High-Reliability Applications

Abstract

The use of semiconductor packages, modules, and printed circuit boards for high-reliability applications, such as the aerospace sector, poses several challenges for original equipment manufacturers (OEMs). Unlike the commercial electronics market, the number of semiconductors used in markets such as aerospace, oil & gas, etc, is tiny, but their reliability requirements are very high. This paper details several ruggedization processes used to address the challenges faced by packages when used in high-reliability applications and demonstrates how modeling and simulation, supported by advanced metrology methods, can help implement commercial-off-the-shelf semiconductor packages.