Integrated high-speed quantum random number generators for mobile, IOT, and edge applications

Abstract

New technological developments such as IoT, Artificial Intelligence and Blockchain are leading our “Data-driven society”, where data generated by physical devices are shared across multiple platforms to improve everyday services. This unique technological evolution also corresponds to new cybersecurity and data-protection risks and challenges as well as computational limitations, which could ultimately impact users’ experience, safety and privacy. The development of products and infrastructure offering long-term security guarantees and stronger computational capabilities is a global priority. Near-term, quantum technologies provide a radically new toolset to realize stronger encryption systems as well as improved randomized algorithms. One such technology is the development of a reliable high-speed and scalable quantum random number generator. In this article, a System in Package (SiP) integration and packaging process is analyzed to bring this component into the low cost and high-volume arena. The proposed SiP solution, combined with existing surface mount technology, offers numerous benefits, such as scalability, smaller physical size, less parasitic effects and lower cost. We will discuss component performance, with insights on interconnect lengths, the shielding effect and the impact of the encapsulants.