Qualitative and Quantitative Microstructural Analysis of Copper for Sintering Process Optimization in Additive Manufacturing Applications

Abstract

Abstract This work will present possibilities for the characterization of copper powder green bodies and sintered copper microstructures during pressureless sintering. The introduction of new parameters to microstructural characterization based on qualitative and quantitative microstructural analysis will facilitate the systematic optimization of the sintering process. As a result of the specific evaluation of the microstructure evolution, conventional isothermal sintering could be successfully replaced by multi-step temperature profiles, thus achieving sintering densities of more than 99 % by simultaneously reducing process time. This systematic optimization of the sintering process of Cu through specific microstructural analysis may now be applied to sinter-based manufacturing technologies such as Binder Jetting and Metal Powder Injection Moulding, enabling the manufacture of complex and highly conductive Cu parts for applications in electronics.