Development of Novel Low Dielectric Epoxy Resin for High Frequency Applications

Abstract

Authors developed novel epoxy resins possessing low dielectric properties and good adhesion simultaneously. Conventional epoxy resins generally perform excellent adhesion to most of organic/inorganic materials, but detract from low dielectric. The designed epoxy resin system achieves that dissipation factor (Df) is approximately 0.006 at 10 GHz while maintaining good adhesive strength to copper. The resin system is recommendable for high frequency applications with high reliability.