Revue Roumaine De Chimie | 2019
Preparation of polyamide 6/copper nanocomposites and its properties
Abstract
Polyamide 6/copper (noted as PA6/Cu) nanocomposites was prepared readily where CuO was used as the filler and adipic acid as the catalyst. CuO was reduced to Cu elemental as well as dispersed in the polymerization system of PA6 via using the reducing atmosphere of the polymerization process. As-prepared PA6/Cu nanocomposites were characterized by means of differential scanning calorimetry (DSC), X-ray diffraction (XRD), ultraviolet-visible absorption spectroscopy (UV) and transmission electron microscopy (TEM). Results showed that CuO was reduced to Cu elemental, and evenly dispersed in PA6 matrix. The melting temperature of PA6 matrix material improved with increasing the content of Cu in comparison with pure PA6, however, the crystallization temperature tended to the low temperature. The crystal structure of PA6/Cu nanocomposites tended to generate γ crystal shape. Additionally, the size of as-fabricated nanoparticle was about 30-50 nm, and the ultraviolet absorption of 360 nm represented the absorption of Cu nanoparticles. The mechanical properties and friction behaviors of PA6/Cu nanocomposites were evaluated by means of universal tensile testing machine, impact testing machine, and friction testing machine. Results showed that as-prepared composites with 0.3% nano-Cu content possessed the best tensile strength of 27.75 MPa, as increased by 29.1% in comparison that of PA6. Furthermore, the impact toughness of PA6/Cu nanocomposites with nano-Cu content of 0.7% reached to 7.20 MPa, as increased by 170.5%. Friction coefficient and grinding spot diameter presented a decreasing tendency with increasing the nano-Cu content.