Archive | 2019

INSPECTION OF PORES AND CONDUCTIVE REGIONS IN DIELECTRIC FILMS

 
 
 
 
 
 
 

Abstract


Электронная техника. Серия 2. Полупроводниковые приборы. Выпуск 4 (255) 2019 strategy. Journal of Vacuum Science and Technology B, vol. 28, iss. 1, 2010, pp. 149-156. 3. Pobedinsky V.V., Rogozin N.V., Lavrentyev E.V., Ryabov A.V., Zenin V.V., Bormontov E.N. Platinovyye stad-bampy s pripoynymi sharikami na alyuminiyevoy metallizatsii kremniyevykh kristallov v tekhnologii «flip-chip» [Platinum stud-bumpers with solder balls on aluminum metallization of silicon die in flip-chip technology]. Electronic engineering. Series 3. Microelectronics, Iss. 2 (170), 2018, pp. 27-31. 4. Chan Seung Hwang, Seung Ouk Jung, Method for manufacturing semiconductor devices having redistribution patterns with a concave pattern in a bump pad area. United States Patent (10) US (ID 6455408 B1 (51) H01L 21/44 (52) 438/613 (2000). 5. Krasnikov G. Ya., Valeev A. S., Shelepin N. A., at al. Sposob izgotovleniya mednoy mnogourovnevoy metallizatsii SBIS [A method for manufacturing multi-level copper metallization of VLSI circuit. Russian Federation Patent (19) RU (ID 240827 (13) C1 (51) H01L 21/283 (2010). 6. Clauberg H. Nickel–palladium bond pads for copper wire bonding. Microelectronics Reliability, 2004. vol. 51. no. 1. pp. 75-80. 7. Zenin V.V., Rogozin N.V., Pobedinsky V.V., et al. Sposob formirovaniya sharikovykh vyvodov na alyuminiyevoy metallizatsii kontaktnykh ploshchadok kristalla [A method of forming a solder ball on the aluminum metallization of the contact pads of the die], Russian Federation Patent (19) RU (ID 2671383 (13) C1 (51) H01L 21/321 (2017). 8. Rogozin N.V., Pobedinsky V.V. Sposob primeneniya platinovoy metallizatsii v sisteme pereraspredeleniya kontaktnykh ploshchadok kristallov integral nykh mikroskhem i poluprovodnikovykh priborov [Method of application of platinum metallization in the system of redistribution of contact areas of die of integrated circuits and semiconductor devices], Russian Federation invention application (19) RU (ID 2019103914 (13) C1 (51) H01L 21/321 H01L 21/321. 9. Yinon Degani, Jeffrey Alan Gregus. Flip chip metallization, United States Patent (10) US (ID 6597069 B1 (51) H01L 23/50 (52) 257/778 (2000). 10. Savitsky E.M., Materialovedeniye platinovykh metallov [The materials science of the platinum metals]. Moscow, Metallurgiya, 1975, 424 p. 11. McAlister A.J., Kahan D.J., The Al-Pt (AluminumPlatinum) System, Bulletin of Alloy Phase Diagrams, 1986, vol. 7, no. 1, pp. 47-51. УДК 621.793 DOI: 10.36845/2073-8250-2019-255-4-35-42

Volume 255
Pages 35-42
DOI 10.36845/2073-8250-2019-255-4-35-42
Language English
Journal None

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