A. Chitnis

Visible light-emitting diodes using a-plane GaN–InGaN multiple quantum wells over r-plane sapphire

We report blue-purple pn-junction light-emitting diodes (LEDs) with a-plane GaN–InGaN multiple quantum well active region. The LEDs were grown over r-plane sapphire substrates. Our study has shown the low pump intensity photoluminencence and electroluminescence to be dominated by emission from the band-tail states which then saturates rapidly giving rise to band-edge emission.

Milliwatt Power Deep Ultraviolet Light-Emitting Diodes Over Sapphire with Emission at 278 nm

We report on AlGaN multiple-quantum-well (MQW)-based deep ultraviolet light-emitting diodes over sapphire with peak emission at 278 nm. A new buffer layer growth process was used to reduce the number of defects and hence the nonradiative recombination. The improved material quality and carrier confinement resulted in pulsed powers as high as 3 mW at 278 nm and a significantly reduced deep-level-assisted long-wavelength emission.

250nmAlGaN light-emitting diodes

We report AlGaN deep ultraviolet light-emitting diodes (LEDs) at 250 and 255nm that have short emission wavelengths. For an unpackaged 200×200μm square geometry LED emitting at 255nm, we measured a peak power of 0.57mW at 1000mA of pulsed pump current. For a similar device emitting at 250nm the peak output power of 0.16mW was measured at 300mA of pulsed pump current. Progress is based on the development of high quality AlGaN cladding layers with an Al content up to 72%, which were grown over AlGaN∕AlN superlattice buffer layers on sapphire substrates. These n-Al0.72Ga0.28N layers were doped with Si up to about 1×1018cm−3 and electron mobilities up to 50cm2∕V∙s were estimated. High resolution x-ray diffraction studies gave a narrow (002) rocking curve with full width at half maximum of only 133arcsec.

Selective area deposited blue GaN–InGaN multiple-quantum well light emitting diodes over silicon substrates

We report on fabrication and characterization of blue GaN–InGaN multi-quantum well (MQW) light-emitting diodes (LEDs) over (111) silicon substrates. Device epilayers were fabricated using unique combination of molecular beam epitaxy and low-pressure metalorganic chemical vapor deposition growth procedure in selective areas defined by openings in a SiO2 mask over the substrates. This selective area deposition procedure in principle can produce multicolor devices using a very simple fabrication procedure. The LEDs had a peak emission wavelength of 465 nm with a full width at half maximum of 40 nm. We also present the spectral emission data with the diodes operating up to 250 °C. The peak emission wavelengths are measured as a function of both dc and pulse bias current and plate temperature to estimate the thermal impedance.

High-efficiency 269 nm emission deep ultraviolet light-emitting diodes

We report on 269 nm emission deep ultraviolet light-emitting diodes (LEDs) over sapphire. The material quality, device design, and contact processing sequence yielded devices with external quantum efficiencies as high as 0.4% for a pumped pulse current of 200 mA and 0.32% for a dc pump current of 10 mA. For a module of two LEDs connected in series, a record continuous-wave power of 0.85 mW (at 40 mA) and a wall plug efficiency of 0.16% (at 10 mA dc) were measured.

Self-heating effects at high pump currents in deep ultraviolet light-emitting diodes at 324 nm

We present a detailed high-pump-current study of self-heating effects in ultraviolet light-emitting diodes (LEDs) grown on sapphire. For deep ultraviolet LEDs on sapphire, our results establish self-heating to be a primary cause of premature power saturation under dc pumping. Even the flip-chip packaged devices undergo a steady-state temperature rise to about 70 °C at a dc pump current of only 50 mA (at 8 V) resulting in a significant decrease in LED output. Temperature rise values estimated from peak emission wavelength shifts and from micro-Raman mapping of the active devices were in good agreement.

Improved performance of 325-nm emission AlGaN ultraviolet light-emitting diodes

We report on AlGaN multiple-quantum-well light-emitting diodes over sapphire with peak emission at 325 nm. A pulsed-atomic-layer-epitaxy growth process was used to improve the material quality of the AlN buffer and the AlN/AlGaN strain-relief layers for reducing the nonradiative recombination. In addition, a modified device epilayer structure was used to improve the carrier confinement and the hole injection. A 40% improvement of external quantum efficiency is obtained, resulting in record high optical powers of 10.2 mW at a pulsed pump current of 1 A.

Ultraviolet Light-Emitting Diodes at 340 nm using Quaternary AlInGaN Multiple Quantum Wells

An ultraviolet light-emitting diode with peak emission wavelength at 340 nm is reported. The active layers of the device were comprised of quaternary AlInGaN/AlInGaN multiple quantum wells, which were deposited over sapphire substrates using a pulsed atomic-layer epitaxy process that allows precise control of the composition and thickness. A comparative study of devices over sapphire and SiC substrates was done to determine the influence of the epilayer design on the performance parameters and the role of substrate absorption.

Thermal management of AlGaN-GaN HFETs on sapphire using flip-chip bonding with epoxy underfill

Self-heating imposes the major limitation on the output power of GaN-based HFETs on sapphire or SiC. SiC substrates allow for a simple device thermal management scheme; however, they are about a factor 20-100 higher in cost than sapphire. Sapphire substrates of diameters exceeding 4 in are easily available but the heat removal through the substrate is inefficient due to its low thermal conductivity. The authors demonstrate that the thermal impedance of GaN based HFETs over sapphire substrates can be significantly reduced by implementing flip-chip bonding with thermal conductive epoxy underfill. They also show that in sapphire-based flip-chip mounted devices the heat spread from the active region under the gate along the GaN buffer and the substrate is the key contributor to the overall thermal impedance.

AlGaN-based 280nm light-emitting diodes with continuous wave powers in excess of 1.5mW

We report on AlGaN-based light-emitting diodes over sapphire with peak emission at 280nm. A modified active layer structure consisting of four multiple quantum wells, addition of an electron blocking magnesium doped p-AlGaN layer, improved contacts along with flip-chip packaging resulted in a cw power of 0.7mW at 230mA for a single 200μm×200μm device. Flip-chipping four 100μm×100μm devices in a parallel configuration improved the dc saturation current and enabled us to obtain a cw power of 1.53mW (at 450mA) and a pulse power as high as 24mW (at 1.5A). These powers translate to values of 0.36% and 0.12% for the external quantum efficiency and the wall plug efficiency.