A. Pépin

Electron beam lithography: resolution limits and applications

Abstract We report on the resolution limits of Electron Beam Lithography (EBL) in the conventional polymethylmethacrylate (PMMA) organic resist. We show that resolution can be pushed below 10 nm for isolated features and how dense arrays of periodic structures can be fabricated at a pitch of 30 nm, leading to a density close to 700 Gbit/in2. We show that intrinsic resolution of the writing in the resist is as small as 3 to 5 nm at high incident electron energy, and that practical resolution is limited by the development of the resist after exposure and by pattern transfer. We present the results of our optimized process for reproducible fabrication of sub-10 nm lines by lift-off and 30-nm pitch pillar arrays by lift-off and reactive ion etching (RIE). We also present some applications of these nanostructures for the fabrication of very high density molds for nano-imprint lithography (NIL) and for the fabrication of Multiple Tunnel Junction devices that can be used for single electron device applications or for the connection of small molecules.

The extracellular matrix guides the orientation of the cell division axis

The cell division axis determines the future positions of daughter cells and is therefore critical for cell fate. The positioning of the division axis has been mostly studied in systems such as embryos or yeasts, in which cell shape is well defined. In these cases, cell shape anisotropy and cell polarity affect spindle orientation. It remains unclear whether cell geometry or cortical cues are determinants for spindle orientation in mammalian cultured cells. The cell environment is composed of an extracellular matrix (ECM), which is connected to the intracellular actin cytoskeleton via transmembrane proteins. We used micro-contact printing to control the spatial distribution of the ECM on the substrate and demonstrated that it has a role in determining the orientation of the division axis of HeLa cells. On the basis of our analysis of the average distributions of actin-binding proteins in interphase and mitosis, we propose that the ECM controls the location of actin dynamics at the membrane, and thus the segregation of cortical components in interphase. This segregation is further maintained on the cortex of mitotic cells and used for spindle orientation.

Anisotropy of cell adhesive microenvironment governs cell internal organization and orientation of polarity

Control of the establishment of cell polarity is an essential function in tissue morphogenesis and renewal that depends on spatial cues provided by the extracellular environment. The molecular role of cell–cell or cell–extracellular matrix (ECM) contacts on the establishment of cell polarity has been well characterized. It has been hypothesized that the geometry of the cell adhesive microenvironment was directing cell surface polarization and internal organization. To define how the extracellular environment affects cell polarity, we analyzed the organization of individual cells plated on defined micropatterned substrates imposing cells to spread on various combinations of adhesive and nonadhesive areas. The reproducible normalization effect on overall cell compartmentalization enabled quantification of the spatial organization of the actin network and associated proteins, the spatial distribution of microtubules, and the positioning of nucleus, centrosome, and Golgi apparatus. By using specific micropatterns and statistical analysis of cell compartment positions, we demonstrated that ECM geometry determines the orientation of cell polarity axes. The nucleus–centrosome orientations were reproducibly directed toward cell adhesive edges. The anisotropy of the cell cortex in response to the adhesive conditions did not affect the centrosome positioning at the cell centroid. Based on the quantification of microtubule plus end distribution we propose a working model that accounts for that observation. We conclude that, in addition to molecular composition and mechanical properties, ECM geometry plays a key role in developmental processes.

Nanofabrication: conventional and nonconventional methods.

Nanofabrication is playing an ever increasing role in science and technology on the nanometer scale and will soon allow us to build systems of the same complexity as found in nature. Conventional methods that emerged from microelectronics are now used for the fabrication of structures for integrated circuits, microelectro‐mechanical systems, microoptics and microanalytical devices. Nonconventional or alternative approaches have changed the way we pattern very fine structures and have brought about a new appreciation of simple and low‐cost techniques. We present an overview of some of these methods, paying particular attention to those which enable large‐scale production of lithographic patterns. We preface the review with a brief primer on lithography and pattern transfer concepts. After reviewing the various patterning techniques, we discuss some recent application issues in the fields of microelectronics, optoelectronics, magnetism as well as in biology and biochemistry.

An integrated AC electrokinetic pump in a microfluidic loop for fast and tunable flow control

We have built a dedicated lab on a chip to study the performance of an integrated electrokinetic micropump, driven by a low voltage AC signal. This micropump consists of an array of interdigitated electrodes and is here integrated in a microfluidic loop. We demonstrate that this device can pump continuously and reproducibly electrolyte solutions of low to moderate ionic strength. The pumping speed reaches up to 500 [micro sign]m s(-1) in 20 [micro sign]m deep and 100 [micro sign]m wide channels with a driving signal in the 1-10 kHz range and an amplitude of only a few volts. In addition, we have observed an interesting reversal of the pumping direction at higher frequencies (50-100 kHz). Our device permits a systematic and automated exploration of the influence of the ionic strength thanks to an integrated micromixer.

Fabrication of microfluidic devices for AC electrokinetic fluid pumping

Two techniques for the fabrication of novel microfluidic devices for electrokinetic fluid pumping are presented. Both consist of forming a micro-channel and reservoirs on a transparent cover sheet and patterning an array of interdigitated asymmetric micro-electrodes on a flat substrate. The two techniques differ from each other in their building materials as well as the pattern replication technique used for the cover sheet fabrication. In the first approach, we used a glass substrate for the electrode fabrication and casting of an elastomer for the cover sheet. In the second approach, both cover sheet and substrate are obtained by imprinting plastic pellets on a pre-patterned or flat mold. In assembled devices, pumping has been demonstrated and characterized by optical microscopy. The observed dependence of the pumping velocity on applied voltage and frequency are in line with theoretical predictions.

Nanoembossing of thermoplastic polymers for microfluidic applications

We present a method for the fabrication of plastic microfluidic devices based on nanoembossing and thermal bonding. By nanoembossing of thermoplastic polymer pellets, both microfluidic deep channels and high resolution features can be formed using a silicon mold fabricated by electron beam lithography and reactive ion etching. By thermal bonding with another plastic sheet, the fabricated microfluidic devices can be sealed without clogging. Observation of pressure driven and electrokinetic flows through high density pillar arrays indicates the feasibility of nanofluidic analysis using plastic devices.

Evidence of stress dependence in SiO2/Si3N4 encapsulation-based layer disordering of GaAs/AlGaAs quantum well heterostructures

Spatial selectivity of layer disordering induced in GaAs/AlGaAs quantum well heterostructures using SiO2 and Si3N4 capping and annealing was investigated using low temperature photoluminescence in conjunction with cross-sectional transmission electron microscopy. Comparative study reveals opposite behaviors for patterned Si3N4 covered with SiO2 and patterned SiO2 covered with Si3N4. In the former, layer disordering occurs in the regions located under the SiO2 strips and in the latter, layer disordering surprisingly occurs under the Si3N4 strips while it is inhibited in the SiO2-capped areas. These results are in agreement with a proposed interdiffusion model based on the effect on Ga vacancy diffusion of the stress distribution generated in the heterostructure during annealing by the capping layers. This work clearly demonstrates that the diffusion of point defects, such as the Ga vacancies, which are responsible for the layer disordering, can be piloted by the stress field imposed to the semiconductor an...

Nanoimprint lithography for the fabrication of DNA electrophoresis chips

We describe the fabrication of microfluidic devices for bio-molecule separation using an array of well-defined nanostructures. Two types of pattern replication of the same device configuration are considered, based on different material processing. In the first approach we use a tri-layer nanoimprint lithography process to pattern a silicon dioxide substrate, on top of which we stick a transparent elastomer cover plate. The second approach relies on direct imprinting of thermoplastic polymer pellets to form two bulk plastic plates later assembled together by thermal bonding. As a result, novel microfluidic devices combining deep and wide channels and a shallower nanostructure array are obtained. The fabricated devices have been characterized by epifluorescence microscopy, using a fluorescein solution to track fluid penetration inside the high density nanostructured region. These realisations not only demonstrate that nanofluidic devices are achievable, but also that they can be manufactured for mass production via nanoimprint-based techniques.

Temperature behavior of multiple tunnel junction devices based on disordered dot arrays

Nanometer-sized multijunction arrays are expected to exhibit a large Coulomb blockade effect. However, up to now, only highly disordered arrays can be fabricated. In this article, we evaluate the consequences of disorder on the dispersion of the device characteristics. We show that, as observed for regular arrays, the threshold voltage Vth increases with the length of the multijunction array. At very low temperature, the Vth dispersion is small. Conversely, at higher temperature, a large dispersion in Vth is observed. We evidence the importance of the different array parameters with respect to the device characteristics. We show that the crucial parameters are the tunnel resistances and, therefore, for a two-dimensional array, the total resistance of the minimal resistance path is the most relevant parameter.