Abhijeet Ashok Chachad

A 600-MHz VLIW DSP

A 600 MHz VLIW DSP, which implements the C64x VelociTI.2/spl trade/ architecture delivers 4800 MIPS, 2400 (16 b) or 4800 (8 b) million multiply accumulates at 0.3 mW/MMAC (16 b). The chip has 64 M transistors and dissipates 718 mW at 600 MHz and 1.2 V, and 200 mW at 300 MHz and 0.9 V. It has an 8-way VLIW DSP core, a 2-level memory system, and 2.4 GB/s I/O bandwidth. The DSP chip is implemented in 0.13 μm CMOS technology with 6-layer copper metalization.

A 65nm C64x+ Multi-Core DSP Platform for Communications Infrastructure

The combined processing power of three 1+GHz DSP cores and 65nm 7M CMOS integration delivers a WCDMA macro base-station on a single chip. The 300M transistor IC can perform up to 24000MIPS, 8000 16b MMACs per second, coupled with symbol-rate and chip-rate acceleration and dissipates less than 6W.

A 1.25GHz 0.8W C66x DSP Core in 40nm CMOS

The next-generation C66x DSP integrated fixed and floating-point DSP implemented in TSMC 40nm process is presented in this paper. The DSP core runs at 1.25GHz at 0.9V and has a standby power consumption of 800mW. The core transistor count is 21.5 million. The DSP core features 8-way VLIW floating point Data path and a two level memory system and delivers 40 GMACS or 10 GFLOPS floating point MAC performance at 1.25GHz.

A 800 MHz system-on-chip for wireless infrastructure applications

The 800MHz System-on-Chip implements the C64x VLIW DSP VelociTI.2/spl trade/ Architecture and delivers 6400 MIPS, 3200 16-bit MMACs, 6400 8-bit MMACs at 0.17 mW/MMAC (8 bit). The chip is implemented in state of the art 90 nm CMOS technology with 7-layer copper metalization. The core dissipates 1080 mW at 800 MHz, 1.2V. The system-on-chip is targeted for high performance wireless infrastructure application. It has an 8-way VLIW DSP core, a 2-level memory system, and an I/O bandwidth of 3.2GB/s.