Abouzar Hamidipour

77-GHz Multi-Channel Radar Transceiver With Antenna in Package

This paper presents the design of a directional folded dipole antenna integrated in an embedded wafer level ball grid array (eWLB) package, the comparison of different antenna designs and the influence of the silicon die and neighboring antennas within the package to the radiation behavior. The co-integration of the antenna and the silicon-based monolithic microwave integrated circuit (MMIC) in a system in package (SiP) approach is a convenient solution to suppress lossy radio frequency (RF) transitions and to simplify the design and the manufacturing of radio frontends significantly. The proposed SiP is focused on 77-GHz automotive radar applications. The MMIC contains the 77-GHz signal source and a transceiver with amplifier and mixer. The gain of different antennas in different constellations within the package is shown.

Highly integrated 79, 94, and 120-GHz SiGe radar frontends

This paper reflects on design aspects for multichannel frequency-continuous wave (FMCW) radar frontends from conception to application on board. In the 79-GHz domain, multi-channel applications are recapitulated, and in the 94-GHz domain, a broadband transceiver is presented along with a voltage-controlled oscillator (VCO) that covers a tuning range of 12 GHz. The functionality of the 94-GHz chipset was verified by means of a four-channel multiple-input multiple-output (MIMO) radar prototype. Finally, a highly integrated 120-GHz transceiver with on-chip signal generation is presented.

Characterization of Differential Transmission Lines for Integrated Millimeter-Wave Applications

This letter focuses on the characterization of differential transmission lines (T-lines) typically used in millimeter-wave integrated circuits. Common- and differential-mode propagation constants were calculated and validated in two experimental steps. A four-port scattering parameter (S-parameter) measurement followed by a multi-line calibration was performed. In addition, several two-port S-parameter measurements were conducted using a set of three marchand baluns. Comparison of the values extracted from simulations and two experiments shows very good agreement over a broad frequency range from 65 to 170 GHz.

On the feasibility of an antenna in package with stacked directors

This paper investigates the feasibility of a gain enhancement technique using stacked directors for antennas in package. A 77-GHz antenna designed for automotive radar applications and a frequency multiplier were integrated in a 6×6mm2 embedded wafer level ball grid array (eWLB) package. The frequency multiplier generates the eighteenth harmonic of its input signal and allows the use of a commercial signal source to characterize the antenna. Parasitic directors were etched on a low-loss 2.54mm thick RT/duroid 5880 LZ laminate by means of photolithography and were mounted on the eWLB package. Theoretical analysis and full electromagnetic simulations were verified against the actual measurements of the antenna radiation beam pattern.

On-wafer passives de-embedding based on open-pad and Transmission Line measurement

In this paper, a new de-embedding technique based on open-pad and Transmission Line (TL) measurement is discussed. This technique can be used as an alternative to the conventional de-embedding approaches in order to characterize on-chip passives in the millimeter wave range of frequencies. Using open-pad measurement, parallel parasitics are extracted and removed in the first step. Cross-talk parasitics between two pads that are kept at a constant distance can be assumed constant, and thus both cross-talk and parallel parasitics can be removed. Subsequently, the transfer function matrix of a single-ended TL is used to de-embed series parasitics from the measurement results. The measurement results are in a close agreement with the simulations up to 110 GHz.

Integrated mm-wave sensors in a package

We present integrated 160-GHz sensors in a package which combine SiGe-based mm-wave circuits with an antenna inside single embedded wafer level ball grid array (eWLB) packages. The eWLB technology provides a platform to realize miniaturized antennas and to easily combine them with other building blocks to create a full mm-wave system in package. With this approach no external mm-wave connections or special low-loss laminates are required. An imaging system based on the packaged sensors was realized and measurements were carried out to demonstrate the easy applicability of the realized components.

Electromagnetic Tomography for Brain Imaging and Stroke Diagnostics: Progress Towards Clinical Application

ElectroMagnetic Tomography (EMT) is an emerging biomedical imaging modality with great potential for non-invasive assessment of acute and chronic functional and pathological conditions of brain tissue. The mission of EMTensor GmbH is to bring this innovative technology into practical diagnostics of brain, including detection of stroke and traumatic brain injuries, followed by 24/7 monitoring of functional viability of tissue and an assessment of efficacy of treatment. The goal is to create a unique infrastructure based on compact-sized devices, information processing systems and services, which will lead to a breakthrough in brain diagnostics. The idea is to shift the paradigm from a reactive approach, where treatment follows a delayed diagnosis, to a proactive and preventive approach, where early diagnosis leads to successive treatment. The topics of this chapter include a brief introduction of the imaging procedures used at EMTensor GmbH. Furthermore, recent improvements of our image reconstruction algorithms will be discussed briefly, followed by a virtual study to explore the spectrum of potential applications of EMT technology for brain diagnostics. In a next step, the EMTensor BRain IMaging scanner Generation 1 (BRIM G1) will be described. In particular, attention will be given to the imaging results obtained with this scanner in clinical trials. Finally, recent improvements on imaging hardware and chamber topology will be discussed, which have been considered in our second generation brain imaging scanner (BRIM G2).