Adolfo Cobo García

Hyperspectral imaging sustains production-process competitiveness

Because of increased worldwide competition, efficiency improvements and establishing processes that are suitable for manufacturing high-end, high-quality products are primary commercial aims. In the agri-food industry, raw-material online characterization during the input stages of processing chains is of key importance for quality control. Classification into different quality categories and separation of unwanted spurious materials are traditionally done based on time-consuming machine-vision techniques. In industrial settings, however, welding-quality monitoring plays a major role, particularly in aeronautics and the nuclear industry, and the appearance of flaws (such as porosities or inclusions) must be prevented. Using x-rays, ultrasound, or other offline nondestructive evaluation techniques is associated with both economic and productivity costs, however. Optical spectroscopy (OS)1 has been widely used in process manufacturing, since each substance is uniquely identifiable from its spectral properties. However, traditional OS techniques generate information about the bulk properties of (or part of) a sample,2 and, in commonly used applications, many aspects of the derived sample properties result from composition heterogeneity. Imaging spectroscopy simultaneously determines the optical spectral components of a particular light-matter interaction (such as absorption) and its spatial location. It can successfully monitor sample heterogeneity. Hyperspectral imagers allow data collection in hundreds or even thousands of spectral bands. Thus, multicomponent information and high sensitivity to minor components are achieved, thus allowing enhanced quality control. Of the different types of imaging spectrometers,3 Figure 1. Global block diagram of our hyperspectral-imaging system for agri-food and industrial applications. LOS: Line of sight. a.u.: Arbitrary units. : Wavelength.

Radial processing scheme of speckle patterns for sensing applications

A processing scheme to enhance the speckle sensitivity to dynamic perturbation has been proposed and tested. Considering different areas within speckle patterns where highest order modes interfere, a better dynamic sensitivity has been achieved

In-process automatic wavelength calibration for CCD-spectrometers

In CCD-spectrometers, the relation between the CCD-pixel number and the associated wavelength is established by means of a calibration polynomial, whose coefficients are typically obtained using a calibration lamp with known emission line wavelengths and a regression procedure. A recalculation of this polynomial has to be performed periodically, as the pixel number versus wavelength relation can change with ambient temperature variations or modifications in the optics attached to the spectrometer connector. Given that this calibration procedure has to be performed off-line, it implies a disturbance for industrial scenarios, where the monitoring setup must be altered. In this paper an automatic wavelength calibration procedure for CCD-spectrometers is proposed. It is based on a processing scheme designed for the in-process estimation of the plasma electronic temperature, where several plasma emission lines are identified for each spectral capture. This identification stage involves the determination, by means of a sub-pixel algorithm, of the central wavelength of those lines, thus allowing an on-line wavelength calibration for each single acquired spectrum. The proposed technique will be demonstrated by means of several experimental arc-welding tests.

Efficient processing technique based on plasma optical spectroscopy for on-line welding quality monitoring

In this paper a new spectroscopic analysis technique is proposed for on-line welding quality monitoring. This approach is based on the estimation of the wavelength associated with the maximum intensity of the background signal (continuum) of the welding plasma spectra. It will be demonstrated that this parameter exhibits a clear correlation with the welding quality of the seams, as it also happens with the traditional spectroscopic approach based on the determination of the plasma electronic temperature, thus allowing an identification of the appearance of weld defects. This technique offers a relevant improvement in terms of computational performance, what enables to detect smaller defects within the seam.