Ahmed Mohammed Adham

Performance Optimization of a Microchannel Heat Sink Using the Improved Strength Pareto Evolutionary Algorithm (SPEA2)

In this paper, a feasible optimization scheme for rectangular microchannel heat sinks, which incorporates the thermal resistance model and the Improved Strength Pareto Evolutionary Algorithm (SPEA2), is reported. An alternative coolant, namely, ammonia gas, is used to improve the overall thermal and hydrodynamic performances of the considered system. Results from the optimization showed significant reduction in the total thermal resistance compared to the conventional air-cooled systems up to 35% for the same allowable pumping power. The SPEA2 exhibited excellent performance when it was compared to another multiobjective algorithm, NSGA2. The results reported in this study open the door for the incorporation of some other algorithms, which have not been used in the optimization of microchannel heat sinks. Finally, the outcome of this paper predicts a promising future for the usage of ammonia gas in the area of electronics cooling.

Optimization of nanofluid-cooled microchannel heat sink

The optimization of a nanofluid-cooled rectangular microchannel heat sink is reported. Two nanofluids with volume fraction of 1 %, 3 %, 5 %, 7 % and 9 % are employed to enhance the overall performance of the system. An optimization scheme is applied consisting of a systematic thermal resistance model as an analysis method and the elitist non-dominated sorting genetic algorithm (NSGA-II). The optimized results showed that the increase in the particles volume fraction results in a decrease in the total thermal resistance and an increase in the pumping power. For volume fractions of 1 %, 3 %, 5 %, 7 % and 9 %, the thermal resistances were 0.072, 0.07151, 0.07075, 0.07024 and 0.070 [oK W-1] for the SiC-H2O while, they were 0.0705, 0.0697, 0.0694, 0.0692 and 0.069 [oK W-1] for the TiO2-H2O. The associated pumping power were 0.633, 0.638, 0.704, 0.757 and 0.807 [W] for the SiC-H2O while they were 0.645, 0.675, 0.724, 0.755 and 0.798 [W] for the TiO2-H2O. In addition, for the same operating conditions, the nanofluid-cooled system outperformed the water-cooled system in terms of the total thermal resistance (0.069 and 0.11 for nanofluid-cooled and water-cooled systems, respectively). Based on the results observed in this study, nanofluids should be considered as the future coolant for electronic devices cooling systems.

Multi-objective optimization algorithms for microchannel heat sink design

This paper investigates the performance of four multi-objective optimization algorithms namely the GAM, MOGA, SPEA2 and NSGA-II on the optimization of a microchannel heat sink based on the total thermal resistance and pumping power. Two case studies with different formulation methodologies were selected for the optimizations. The optimizations results showed that both SPEA2 and NSGA-II algorithms exhibited excellent performance in terms of the number of the optimal solutions, maintaining the desirable diversity and convergence speed toward the Pareto optimal front as compared to GAM and MOGA.

Cooling of a rectangular microchannel heat sink with ammonia gas

The increased global demands for the minimization of integrated circuits used in electronic devices have led manufacturing companies to direct their resources towards research in that area. The minimization processes provided very powerful electronic chips but with a very large amount of heat generation. One of the methods applied to remove the heat produced is to use a microchannel heat sink. Past optimization attempts have looked at the microchannel geometry, material, and coolant types using various models to represent the heat sink. This paper reports the analytical study on the optimization of the thermal resistance and pressure drop of a rectangular microchannel heat sink using a new coolant, ammonia gas. The effect of different channel aspect ratio was investigated. Significant reduction in thermal resistance was obtained with 0.218 K/W for ammonia gas compared to that of 0.266 k/W for air under the same operating conditions. The total pressure drop achieved was 5.36 mbar and 9.52 mbar for ammonia and air respectively. The results indicate promising potential for ammonia gas as a coolant for rectangular microchannel heat sink.