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Aiping Xian

Chinese Academy of Sciences

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Publication

Featured researches published by Aiping Xian.

Solid State Phenomena | 2007

C-Doped TiO2 with Visible Light Photocatalytic Activity

C.X. Dong; Aiping Xian; En Hou Han; Jian Ku Shang

Carbon doped titanium dioxide photocatalysts have been synthesized by a precipitation method. Anatase TiO2 was obtained when the precipitate was heat-treated at 400°C when rutile phase appeared at 600°C. The absorption spectra of the powders showed strong absorption in visible region. For the sample calcined at 400 °C , the absorption extended up to 750nm. X-ray photoelectron spectrum (XPS) confirmed that carbon atoms were incorporated into the TiO2 crystal lattice. Photodegradation experiments showed that the powders had visible-light degradation activity.

Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2006

Pinning of grain boundaries by second phase particles in equal-channel angularly pressed Cu-Fe-P alloy

H. Cao; J. Y. Min; S.D. Wu; Aiping Xian; Jian Ku Shang

Journal of Electronic Materials | 2009

Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition

Meng Liu; Aiping Xian

Journal of Materials Science & Technology | 2007

Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder

Jian Jun Guo; Lei Zhang; Aiping Xian; Jian Ku Shang

Journal of Electronic Materials | 2005

Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure

Q. L. Zeng; Zhongguang Wang; Aiping Xian; Jian Ku Shang

Journal of Materials Science | 2006

Acid-mediated sol–gel synthesis of visible-light active photocatalysts

C.X. Dong; Aiping Xian; En-Hou Han; Jian Ku Shang

Journal of Electronic Materials | 2007

Oxidation Behavior of Molten Tin Doped with Phosphorus

Aiping Xian; Guo-Liang Gong

Journal of Electronic Materials | 2011

Tin Whisker Growth on NdSn 3 Powder

Hong-Chang Shi; Aiping Xian

Journal of Materials Science & Technology | 2007

Microstructural Evolution and Cracking of Pb-free Ball Grid Array Assemblies under Thermal Cycling

Wei Wang; Zhongguang Wang; Aiping Xian; Jian Ku Shang

Chinese Journal of Materials Research | 2004

Low cycle fatigue behavior of Sn-3.8Ag-0.7Cu lead-free solder

Q. L. Zeng; Zhongguang Wang; Aiping Xian; Jian Ku Shang

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Zhongguang Wang

Chinese Academy of Sciences

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C.X. Dong

Chinese Academy of Sciences

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Q. L. Zeng

Chinese Academy of Sciences

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En-Hou Han

Chinese Academy of Sciences

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Guo-Liang Gong

Chinese Academy of Sciences

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Hong-Chang Shi

Chinese Academy of Sciences

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Jian Jun Guo

Chinese Academy of Sciences

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Lei Zhang

Chinese Academy of Sciences

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Meng Liu

Chinese Academy of Sciences

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S.D. Wu

Chinese Academy of Sciences

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