Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Ajoy Kumar Ray is active.

Publication


Featured researches published by Ajoy Kumar Ray.


Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2002

Fabrication of TiN reinforced aluminium metal matrix composites through a powder metallurgical route

Ajoy Kumar Ray; K. Venkateswarlu; S.K Chaudhury; Swadesh K. Das; B. Ravi Kumar; L C Pathak

Fabrication of Al–TiN (10, 30 wt.%) composites by a powder metallurgical route has been investigated using pressureless sintering and hot pressing techniques. Results indicate that sintering followed by hot pressing is required for significant densification and improvement of mechanical properties. The presence of titanium nitride (TiN) particles at grain boundaries played a significant role in improving the densification, and results in improved mechanical properties. Dry sliding wear results showed improved wear resistance of the composite (Al–TiN) compared to the base material (Al) metal due to presence of TiN particles. The wear rates of the Al–TiN composites decrease by an order of magnitude after hot pressing.


Materials Science and Technology | 2010

Effect of Mn on Sn–Ag–Cu ternary lead free solder alloy–Cu assembly: a comparative study

Madhumala Ghosh; M K Gunjan; Swapan K Das; Abhijit Kar; R N Ghosh; Ajoy Kumar Ray

Abstract In the present investigation, transition joints were produced by soldering Sn–Ag–Cu and Sn–Ag–Cu–Mn alloys to Cu substrate. Microstructure and mechanical properties of the assemblies were determined in reflowed condition and after aging at 100°C for variable time. The shear strength as well as the reaction layer thickness of Sn–Ag–Cu versus Cu is lower in comparison to Sn–Ag–Cu– Mn versus Cu solder assembly in reflowed condition. The reaction zone for Sn–Ag–Cu versus Cu is decorated with Cu3Sn and Cu6Sn5; however, in the case of Sn–Ag–Cu–Mn versus Cu assembly only Cu6Sn5 was observed. Mn is responsible for enhanced width of Cu6Sn5, which act as a barrier layer restricting the diffusion of Sn across the interface and Cu3Sn formation has not been found even after aging of 200 h. Aging treatment leads to growth of intermetallic layer for both the joints and decrement in shear strength of the assemblies. Still Sn–Ag–Cu–Mn versus Cu solder assembly exhibits superior mechanical strength than Sn–Ag–Cu versus Cu transition joint.


Canadian Metallurgical Quarterly | 2008

Damage Resistance of a Thermal Barrier Coated Superalloy for Combustor Liners in Aero Turbines During Fatigue and Creep

Ashok K Ray; B Goswami; Abhijit Kar; Ajoy Kumar Ray; H K Das; P K Roy; S B Kumar; S C Bose

Abstract This paper deals with an evaluation of the lifetime of a thermal barrier coated (TBC) C263 superalloy under fatigue and creep loading. Results revealed that both TBC and bond-coated substrate had higher endurance limits than the base alloy, while the opposite was found for high stress, low cyclic lifetimes. At high stress, the premature failure for these two materials is possibly due to high stress crack initiation/growth in the TBC/bond coat layers. Oxidation is the cause of the reduced life of the bare substrate as compared to the coated substrate while fatigue and creep experiments are carried out in an oxidizing environment. During 800 °C fatigue, the bare specimens behave differently from the coated specimens, but both the bond-coated only and bond coat + TBC specimens seem to exhibit very similar results that are within experimental scatter. Delamination of the bond coat, oxidation of the substrate and spallation of the ceramic layer were evident at very high fatigue and creep stresses. Lateral cracks that grew in the ceramic layer parallel to the stress axis were responsible for spallation of the top coat (TBC) at a very high fatigue stress, whereas, at low creep stress, spallation of the top coat was due to the growth of alumina scale (of thickness >3μm) at the top coat (TBC)/bond coat interface.


Archive | 2012

Ceramic-Metal Joining Using Active Filler Alloy-An In-Depth Electron Microscopic Study

Abhijit Kar; Ajoy Kumar Ray

Joining of materials provides a means of fabricating structures, where difficulty is encountered to make one piece directly. Very often joining can be considered to be less expensive than making single piece structure for many intricate shaped components. Brazing is one of the most important techniques for joining various materials especially ceramics. To fabricate near net shape joined component or to make prototypes of intricate shapes, joining of ceramics to ceramics/metals, brazing has been considered as the most frequently used technique. Due to their excellent high temperature strength, resistance to corrosion and wear, application of ceramics in structural components, has received extensive attention in recent decades. However difficulties on joining ceramics with metals restrict their use in many occasions. The ability to produce a reliable ceramicceramic/metal and composite joint is a key enabling technology for many productions, prototype and advanced developmental items and assemblies. Thus it becomes an interesting challenge to the researchers for ceramic-metal joining.[1,2] Amongst several ceramic joining processes, active metal brazing is one of the most extensively used joining techniques for metal-ceramic joining. In this process, bonding is promoted by the use of an active filler alloy. The active filler alloy containing a small amount of an active element which is capable of reacting with the ceramic substrate facilitates joining.[3-12]. Characteristics of filler alloy play a significant role in obtaining unique joining properties. Filler alloy should have the liquidus temperature, below the melting point of the substrate to be joined and also must be capable of producing joint at a temperature where the properties of base materials are not degraded


Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2004

Correlation between the mechanical properties and the microstructural behaviour of Al2O3-(Ag-Cu-Ti) brazed joints

Sudipta Mandal; Ashok K Ray; Ajoy Kumar Ray


Materials & Design | 2010

Optimization of friction stir welding parameters for dissimilar aluminum alloys

Mainak Ghosh; K Kumar; Satish V. Kailas; Ajoy Kumar Ray


Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2004

Microstructure, tensile strength and wear behaviour of Al–Sc alloy

K. Venkateswarlu; L C Pathak; Ajoy Kumar Ray; Goutam Das; P K Verma; M Kumar; R N Ghosh


Journal of the American Ceramic Society | 2004

Carbothermal Synthesis of Nanocrystalline Aluminum Nitride Powders

L C Pathak; Ajoy Kumar Ray; Samar Das; C. S. Sivaramakrishnan; P. Ramachandrarao


Journal of the American Ceramic Society | 2004

Effect of Fe and Cr Addition on the Sintering Behavior of ZrB2 Produced by Self‐Propagating High‐Temperature Synthesis

Suman K Mishra; Swapan K Das; Ajoy Kumar Ray; P. Ramachandrarao


Carbon | 2012

Preparation and characterization of graphene and Ni-decorated graphene using flower petals as the precursor material

Ajoy Kumar Ray; Ranjan K. Sahu; V. Rajinikanth; Himangshu Bapari; Mainak Ghosh; Parimal Paul

Collaboration


Dive into the Ajoy Kumar Ray's collaboration.

Top Co-Authors

Avatar
Top Co-Authors

Avatar

R N Ghosh

Council of Scientific and Industrial Research

View shared research outputs
Top Co-Authors

Avatar

Mainak Ghosh

Council of Scientific and Industrial Research

View shared research outputs
Top Co-Authors

Avatar

K. Venkateswarlu

National Aerospace Laboratories

View shared research outputs
Top Co-Authors

Avatar

L C Pathak

Council of Scientific and Industrial Research

View shared research outputs
Top Co-Authors

Avatar

Sudipta Mandal

Council of Scientific and Industrial Research

View shared research outputs
Top Co-Authors

Avatar

Ashok K Ray

Council of Scientific and Industrial Research

View shared research outputs
Top Co-Authors

Avatar

Swapan K Das

Council of Scientific and Industrial Research

View shared research outputs
Top Co-Authors

Avatar

Goutam Das

Council of Scientific and Industrial Research

View shared research outputs
Top Co-Authors

Avatar

M Ghosh

Council of Scientific and Industrial Research

View shared research outputs
Researchain Logo
Decentralizing Knowledge