Ajoy Kumar Ray
Council of Scientific and Industrial Research
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Featured researches published by Ajoy Kumar Ray.
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2002
Ajoy Kumar Ray; K. Venkateswarlu; S.K Chaudhury; Swadesh K. Das; B. Ravi Kumar; L C Pathak
Fabrication of Al–TiN (10, 30 wt.%) composites by a powder metallurgical route has been investigated using pressureless sintering and hot pressing techniques. Results indicate that sintering followed by hot pressing is required for significant densification and improvement of mechanical properties. The presence of titanium nitride (TiN) particles at grain boundaries played a significant role in improving the densification, and results in improved mechanical properties. Dry sliding wear results showed improved wear resistance of the composite (Al–TiN) compared to the base material (Al) metal due to presence of TiN particles. The wear rates of the Al–TiN composites decrease by an order of magnitude after hot pressing.
Materials Science and Technology | 2010
Madhumala Ghosh; M K Gunjan; Swapan K Das; Abhijit Kar; R N Ghosh; Ajoy Kumar Ray
Abstract In the present investigation, transition joints were produced by soldering Sn–Ag–Cu and Sn–Ag–Cu–Mn alloys to Cu substrate. Microstructure and mechanical properties of the assemblies were determined in reflowed condition and after aging at 100°C for variable time. The shear strength as well as the reaction layer thickness of Sn–Ag–Cu versus Cu is lower in comparison to Sn–Ag–Cu– Mn versus Cu solder assembly in reflowed condition. The reaction zone for Sn–Ag–Cu versus Cu is decorated with Cu3Sn and Cu6Sn5; however, in the case of Sn–Ag–Cu–Mn versus Cu assembly only Cu6Sn5 was observed. Mn is responsible for enhanced width of Cu6Sn5, which act as a barrier layer restricting the diffusion of Sn across the interface and Cu3Sn formation has not been found even after aging of 200 h. Aging treatment leads to growth of intermetallic layer for both the joints and decrement in shear strength of the assemblies. Still Sn–Ag–Cu–Mn versus Cu solder assembly exhibits superior mechanical strength than Sn–Ag–Cu versus Cu transition joint.
Canadian Metallurgical Quarterly | 2008
Ashok K Ray; B Goswami; Abhijit Kar; Ajoy Kumar Ray; H K Das; P K Roy; S B Kumar; S C Bose
Abstract This paper deals with an evaluation of the lifetime of a thermal barrier coated (TBC) C263 superalloy under fatigue and creep loading. Results revealed that both TBC and bond-coated substrate had higher endurance limits than the base alloy, while the opposite was found for high stress, low cyclic lifetimes. At high stress, the premature failure for these two materials is possibly due to high stress crack initiation/growth in the TBC/bond coat layers. Oxidation is the cause of the reduced life of the bare substrate as compared to the coated substrate while fatigue and creep experiments are carried out in an oxidizing environment. During 800 °C fatigue, the bare specimens behave differently from the coated specimens, but both the bond-coated only and bond coat + TBC specimens seem to exhibit very similar results that are within experimental scatter. Delamination of the bond coat, oxidation of the substrate and spallation of the ceramic layer were evident at very high fatigue and creep stresses. Lateral cracks that grew in the ceramic layer parallel to the stress axis were responsible for spallation of the top coat (TBC) at a very high fatigue stress, whereas, at low creep stress, spallation of the top coat was due to the growth of alumina scale (of thickness >3μm) at the top coat (TBC)/bond coat interface.
Archive | 2012
Abhijit Kar; Ajoy Kumar Ray
Joining of materials provides a means of fabricating structures, where difficulty is encountered to make one piece directly. Very often joining can be considered to be less expensive than making single piece structure for many intricate shaped components. Brazing is one of the most important techniques for joining various materials especially ceramics. To fabricate near net shape joined component or to make prototypes of intricate shapes, joining of ceramics to ceramics/metals, brazing has been considered as the most frequently used technique. Due to their excellent high temperature strength, resistance to corrosion and wear, application of ceramics in structural components, has received extensive attention in recent decades. However difficulties on joining ceramics with metals restrict their use in many occasions. The ability to produce a reliable ceramicceramic/metal and composite joint is a key enabling technology for many productions, prototype and advanced developmental items and assemblies. Thus it becomes an interesting challenge to the researchers for ceramic-metal joining.[1,2] Amongst several ceramic joining processes, active metal brazing is one of the most extensively used joining techniques for metal-ceramic joining. In this process, bonding is promoted by the use of an active filler alloy. The active filler alloy containing a small amount of an active element which is capable of reacting with the ceramic substrate facilitates joining.[3-12]. Characteristics of filler alloy play a significant role in obtaining unique joining properties. Filler alloy should have the liquidus temperature, below the melting point of the substrate to be joined and also must be capable of producing joint at a temperature where the properties of base materials are not degraded
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2004
Sudipta Mandal; Ashok K Ray; Ajoy Kumar Ray
Materials & Design | 2010
Mainak Ghosh; K Kumar; Satish V. Kailas; Ajoy Kumar Ray
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2004
K. Venkateswarlu; L C Pathak; Ajoy Kumar Ray; Goutam Das; P K Verma; M Kumar; R N Ghosh
Journal of the American Ceramic Society | 2004
L C Pathak; Ajoy Kumar Ray; Samar Das; C. S. Sivaramakrishnan; P. Ramachandrarao
Journal of the American Ceramic Society | 2004
Suman K Mishra; Swapan K Das; Ajoy Kumar Ray; P. Ramachandrarao
Carbon | 2012
Ajoy Kumar Ray; Ranjan K. Sahu; V. Rajinikanth; Himangshu Bapari; Mainak Ghosh; Parimal Paul