Akira Kusano

3D inspection of electronic devices by means of stereo method on single camera environment

It is very important to guarantee the quality of the industrial products by means of visual inspection. In order to reduce the soldering defect with terminal deformation and terminal burr in the manufacturing process, this paper proposes a 3D visual inspection system based on a stereo vision with single camera. It is technically noted that the base line of this single camera stereo was precisely calibrated by the image processing procedure. Also to extract the measuring point coordinates for computing disparity; the error is reduced with original algorithm. Comparing its performance with that of human inspection using industrial microscope, the proposed 3D inspection could be an alternative in precision and in processing cost. Since the practical specification in 3D precision is less than 1 pixel and the experimental performance was around the same, it was demonstrated by the proposed system that the soldering defect with terminal deformation and terminal burr in inspection, especially in 3D inspection, was decreased. In order to realize the inline inspection, this paper will suggest how the human inspection of the products could be modeled and be implemented by the computer system especially in manufacturing process.

Defect detection of terminal lead by single stereo vision

Due to the miniaturization and complication of the size of electronic devices, it is recently required to maximize the inspection performance especially in precision. It is especially difficult to detect very small defects of the small electronic devices in size. In addition to these requirements, the performances of the inspection in cost and speed should be realized. For realizing these subjects of the inspection, image processing based on the silhouette and 3D images is promising. Especially, because the defect of terminal lead causes the failure of the solder on the printed circuit board, the defects on the terminal leads become fatal. Then we applied 3D images to the inspection of terminal lead for improving its performance in size. In this case we implemented a single camera 3D image acquisition system small enough for the real application to the production line.

Defect detection of electronic devices by single stereo vision

It is very important to guarantee the quality of the industrial products by means of visual inspection. In order to reduce the soldering defect with terminal deformation and terminal burr in the manufacturing process, this paper proposes a 3D visual inspection system based on a stereo vision with single camera. It is technically noted that the base line of this single camera stereo was precisely calibrated by the image processing procedure. Also to extract the measuring point coordinates for computing disparity; the error is reduced with original algorithm. Comparing its performance with that of human inspection using industrial microscope, the proposed 3D inspection could be an alternative in precision and in processing cost. Since the practical specification in 3D precision is less than 0.02 mm and the experimental performance was around the same, it was demonstrated by the proposed system that the soldering defect with terminal deformation and terminal burr in inspection, especially in 3D inspection, was decreased. In order to realize the inline inspection, this paper will suggest how the human inspection of the products could be modeled and be implemented by the computer system especially in manufacturing process.

3D Precise Inspection of Terminal Lead for Electronic Devices by Single Camera Stereo Vision

It is very important to guarantee the quality of the industrial products by means of visual inspection. In order to reduce the soldering defect with terminal deformation and terminal burr in the manufacturing process, this paper proposes a 3D visual inspection system based on a stereo vision with single camera. It is technically noted that the base line of this single camera stereo was precisely calibrated by the image processing procedure. Also to extract the measuring point coordinates for computing disparity; the error is reduced with original algorithm. Comparing its performance with that of human inspection using industrial microscope, the proposed 3D inspection could be an alternative in precision and in processing cost. Since the practical specification in 3D precision is less than 1 pixel and the experimental performance was around the same, it was demonstrated by the proposed system that the soldering defect with terminal deformation and terminal burr in inspection, especially in 3D inspection, was decreased. In order to realize the inline inspection, this paper will suggest how the human inspection of the products could be modeled and be implemented by the computer system especially in manufacturing process.