Alan M. Litman

Selecting Plastic Parts for Computer-Aided Engineering Analysis

Abstract The use of computer-aided engineering (CAE) technologies for analyzing critical plastic parts has increased tremendously within the plastic industry and Xerox. During the last three years, significant advancements have been made in both polymer melt flow analysis (Moldflow, FA, TM Series) and heat transfer analysis (Polycool, Moldcool) programs to aid in the design of plastic parts and molds. (Moldflow is a registered trademark of Moldflow Australia Pty. Ltd., FA, and TM are a registered trademark of Plastics and Computer Co. Polycool is a registered trademark of General Electric Co. Moldcool is a registered trademark of AEC Corp.) These computer simulation techniques optimize material flow, processing, and cooling parameters as well as providing the ability to balance multicavity tools. However, the utilization of these simulation techniques may be both time consuming and expensive. This paper describes a step-by-step procedure for selecting plastic parts for CAE analysis.

A Technical Assessment of the Static Decay Properties of Various Conductive Plastic Materials

Abstract Plastic materials are inherently insulators and hence susceptible to the accumulation of static electricity. This buildup of static charge may create severe problems in many areas where plastics are used such as in hospital environments, fiber spinning and processing, explosives manufacture, and packaging of sensitive electronic components. With the ever-increasing use of electronic integrated circuits in business equipment, the need to protect these circuits from operator-induced static discharge (such as obtained from walking on a carpet) becomes vitally important. Therefore, the ability to eliminate unwanted static charges at low cost is very desirable.