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Alex P. Pamatat

Freescale Semiconductor

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Publication

Featured researches published by Alex P. Pamatat.

Archive | 2011

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

Ruben B. Montez; Alex P. Pamatat

Archive | 2006

Polishing pad, a polishing apparatus, and a process for using the polishing pad

Brian E. Bottema; Stephen F. Abraham; Alex P. Pamatat

Archive | 2006

Grooved platen with channels or pathway to ambient air

Brian E. Bottema; Stephen F. Abraham; Alex P. Pamatat

Archive | 2005

Platen endpoint window with pressure relief

Brian E. Bottema; Stephen F. Abraham; Alex P. Pamatat

Archive | 2008

PROCESS OF USING A POLISHING APPARATUS INCLUDING A PLATEN WINDOW AND A POLISHING PAD

Brian E. Bottema; Stephen F. Abraham; Alex P. Pamatat

Archive | 2005

Polishing carrier head with a modified pressure profile

Brian E. Bottema; Keven A. Cline; Alex P. Pamatat; Nathan R. Brown

Archive | 2010

Method of fabricating a semiconductor device that limits damage to elements of the semiconductor device that are exposed during processing

Lisa H. Karlin; Lianjun Liu; Alex P. Pamatat; Paul M. Winebarger

Archive | 2013

Cavity based packaging for MEMS devices

Lisa H. Karlin; Lianjun Liu; Alex P. Pamatat; Paul M. Winebarger

Archive | 2010

Collage d'un substrat à un matériau en métal, germanium et silicium

Ruben B. Montez; Alex P. Pamatat

Archive | 2010

Substratklebung mit metall-germanium-siliziummaterial

Ruben B. Montez; Alex P. Pamatat

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Collaboration

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Brian E. Bottema

Freescale Semiconductor

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Stephen F. Abraham

Freescale Semiconductor

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Ruben B. Montez

Freescale Semiconductor

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Lianjun Liu

Freescale Semiconductor

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Lisa H. Karlin

Freescale Semiconductor

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Paul M. Winebarger

Freescale Semiconductor

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Keven A. Cline

Freescale Semiconductor

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Nathan R. Brown

Freescale Semiconductor

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