Alexander Goudelev

Multilayer Antenna Package for IEEE 802.11ad Employing Ultralow-Cost FR4

This paper demonstrates the possibility and feasibility of an ultralow-cost antenna-in-package (AiP) solution for the upcoming generation of wireless local area networks (WLANs) denoted as IEEE802.11ad. The iterative design procedure focuses on maximally alleviating the inherent disadvantages of high-volume FR4 process at 60 GHz such as its relatively high material loss and fabrication restrictions. Within the planar antenna package, the antenna element, vertical transition, antenna feedline, and low- and high-speed interfaces are allocated in a vertical schematic. A circular stacked patch antenna renders the antenna package to exhibit 10-dB return loss bandwidth from 57-66 GHz. An embedded coplanar waveguide (CPW) topology is adopted for the antenna feedline and features less than 0.24 dB/mm in unit loss, which is extracted from measured parametric studies. The fabricated single antenna package is 9 mm × 6 mm × 0.404 mm in dimension. A multiple-element antenna package is fabricated, and its feasibility for future phase array applications is studied. Far-field radiation measurement using an inhouse radio-frequency (RF) probe station validates the single-antenna package to exhibit more than 4.1-dBi gain and 76% radiation efficiency.

Monolithic Circular Stacked Antenna array using high-volume LTCC technology for 60 GHz

The design, fabrication and measurement of a monolithic Circular Stacked Antenna (CSA) array for 60 GHz applications in consumer electronics is presented and proposed. The multilayer CSA is devised using LTCC printing technology for high-volume production scenarios. A detailed study of the antenna element topology and antenna array layout is presented. Simulated and measured results indicate the CSA array features 2∶1 VSWR from 57 GHz to 66 GHz and more than 15.5 dBi gain at boresight angle.

Integrated board-level phased array antenna solution for 60 GHz radio

A novel integrated board-level phased array antenna package devised using low-cost, high volume PCB (FR4) is presented. The presented antenna topology eliminates the need for ball grid array (BGA)/land grid array (LGA) type surface mount packaging as the antenna is directly embedded in the circuit board. This results in significant reduction in fabrication and mass production cost. A multi-element array antenna prototype is simulated, fabricated and measured and its performance is determined to be applicable for gigabit WiFi such as WiGig and IEEE 802.11ad.

Reconfigurable antenna for concurrent operation over cellular and connectivity bands

Two frequency-reconfigurable antennas are combined to operate concurrently over cellular and connectivity bands. The operation band of each antenna is selected by the states of two PIN diodes. Five frequency bands are covered through two different ports. The antenna gain is almost constant at four bands. The isolation between the two ports is larger than 15 dB. This technique will enhance the possibility of designing the practical reconfigurable antenna with high efficiency operating concurrently over cellular and connectivity bands.

Metal chassis robust antenna on compact AMC structure for commercial slim TV

This paper presents first reported specific technique for reducing metal chassis effect to Wi-Fi antenna on smart TV. By using compact AMC structure on the metal chassis, efficiency of the proposed antenna is above 67% within 3mm gap between antenna and metal chassis of TV. For productivity of set, the size of AMC structure is mainly considered to 11mm × 25mm limited area within 1mm thickness of FR4 PCB. The method of miniaturization of AMC structure is also represented. This solution will help to integrate Wi-Fi antenna within TV enclosed with metal chassis.