Allen Cowen

Smart MEMS: flip chip integration of MEMS and electronics

This paper will describe a new approach to the integration of electronics with MEMS, or Smart MEMS. Flip chip solder bumping of integrated circuits is routinely used for packaging purposes and has now been extended to the placement of electronics in close proximity to MEMS devices. The flip chip approach separates the fabrication of the MEMS and electronic devices, allowing both the ICs and MEMS to be fabricated of many different substrate materials, not just single crystal silicon. The close proximity of the electronics to the MEMS devices is very desirable to improve signal to noise performance, and provide higher levels of systems integration. This new approach provides batch fabrication capability as opposed to the serial hybrid approach, without having to fabricate the electronics and MEMS on the same chip. Results on the attachment of surface micromachined structures to glass and silicon substrates will be reported.

MEMS infrastructure: the multiuser MEMS processes (MUMPs)

In order to help provide access to advanced MEMS technologies, and lower the barriers for both industry and academia, MCNC, and ARPA have developed a program which works to provide users with access to both MEMS processes and advanced integration techniques. The two distinct aspects of this program, the MUMPs and Smart MEMS, will be described in this paper. The multi-user MEMS processes (MUMPs) is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. MUMPs is a proof-of-concept and educational tool to aid the developemnt of MEMS in the domestic community. MUMPs technologies currently include a 3-layer polysilicon surface micromachining process and LIGA processes that provide reasonable design flexibility within set guidelines. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology.

A novel two axis actuator for high speed large angular rotation

Reports the development of a novel two axis rotary actuator capable of high frequency out-of-plane rotation in two fully independent axes with large angular excursions. Initial results indicate that using the novel suspension and actuation mechanism presented permits large rotations exceeding /spl plusmn/13.5 degrees at rotational speeds exceeding 15 kHz, using excitation voltages below 100 V. The device is fabricated using a combination of surface and bulk micromachining. In this work the actuators are used to rotate single crystal silicon plates of sizes up to 1 mm/sup 2/. The size of such a device is less than 4 mm/sup 2/ making it suitable for a variety of new applications, such as micropositioning systems, inertial systems, microoptical elements, and compact imaging systems.

Characterization study of flip chip integration for MEMS

This paper will describe the characterization study conducted to determine the suitability of Flip Chip integration of electronics with MEMS. Successful demonstration of the operation of various MEMS devices in conjunction with Flip Chip is reported. Flip chip solder bumping of integrated circuits is routinely used for packaging purposes and has now been extended to the placement of electronics in close proximity to MEMS devices. The flip chip approach separates the fabrication of the MEMS and electronic devices, allowing both the ICs and MEMS to be fabricated of many different substrate materials, not just single crystal silicon. The close proximity of the electronics to the MEMS devices is very desirable to improve signal to noise performance, and provide higher levels of systems integration. This new approach provides batch fabrication capability as opposed to the serial hybrid approach, without having to fabricate the electronics and MEMS on the same chip. Results on the characterization study of attachment of surface and bulk micromachined structures to glass and silicon substrates is reported.

Integration of MUMPS and electronics for system prototyping

In order to create true Smart MEMS systems, the integration of electronics with the MEMS devices is essential. There are currently three methods of integration available: monolithic integration, flip chip attachment and hybrid assembly. The use of flip chip attachment for Smart MEMS has previously been described, and is now available as part of the ARPA- supported MEMS infrastructure programs MUMPs and TechNet. This paper will describe the electromechanical control system chip and the method of using it in conjunction with MUMPs to develop Smart MEMS prototypes.