Amin Enayati

Novel Low-Cost End-Wall Microstrip-to-Waveguide Splitter Transition

A novel conflguration for an end-wall microstrip-to- waveguide splitter transition is presented suitable for use in series fed microstrip arrays. The low price, simplicity, manufacturability, low sensitivity, and also wideband operation, up to more than 37%, is the result of positive interaction between double slots and double stubs. The transition is applied to a dual band 1 £ 2 array. A wideband non-tilted pattern is achieved.

Millimeter-Wave Horn-Type Antenna-in-Package Solution Fabricated in a Teflon-Based Multilayer PCB Technology

An antenna-in-package solution is introduced for millimeter-wave applications. The solution is implemented in an asymmetric PCB technology incorporating 4 laminates of a Teflon-based and one laminate of a Ceramic-based material. A Horn-like element embedded in the PCB technology is designed and manufactured. The simulated and measured return losses are better than 10 dB in the frequency band 55–68 GHz, which makes the element suitable to be used for 60 GHz multi-Gb/Sec applications. The antenna element also provides 6 dB of gain with a ripple less that 0.5 dB from 53 GHz to 60 GHz. Moreover, 3 different arrays have been designed using the same Horn-like antenna as the radiating element. The simulated and measured radiation characteristics of all the antennas are investigated at different frequencies. It is shown that the antenna element is capable of being arrayed for applications where non-line-of-sight communication is needed or multi-path spatial diversity techniques are to be implemented.

Wideband Single-Layer DC-Decoupled Substrate Integrated Waveguide (SIW) - to - Microstrip Transition Using an Interdigital Configuration

A transition from the substrate integrated waveguide (SIW) to the microstrip line with built-in dc-decoupling is presented. The proposed transition has an interdigital configuration on a single layer. It features a 25% relative bandwidth with less than 0.7 dB of insertion loss and more than 15 dB of return loss.

3D-Antenna-in-Package Solution for Microwave Wireless Sensor Network Nodes

A three-dimensional packaging solution is introduced for wireless sensor network nodes at microwave frequencies. The package has a cubic geometry with radiating antennas on its surrounding faces. The cube which is called e-CUBE is designed in such a way that its radiation pattern resembles that of a simple dipole. The antenna is designed in a modular way and the final structure has a return loss better than 10 dB and a dipole-shape pattern at 17.2 GHz. Moreover, the measurement and simulation results show very good agreement.

Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology

A cavity-backed antenna element is introduced and investigated for the antenna-in-package applications at 60GHz frequency band. A thin-film Silicon-based technology is used to implement the antenna element and two different configurations for 1×4 arrays of the same element. The feeding networks of the arrays are designed in such a manner that one of them has its main beam in the broad-side direction while the main beam of the second one is rotated to 45 degrees. Simulation and measurement results of return loss, radiation patterns and realized peak gains are compared.

Low-Radiation-Loss Waveguide-to-Microstrip Transition Using a Double Slit Configuration for Microstrip Array Feeding

In this paper, a waveguide-to-microstrip transition is introduced. This end-wall transition employs a double slit configuration in the ground plane of a microstrip line to couple the electromagnetic waves. The purposed transition features lower radiation losses in comparison with existing waveguide-to-microstrip transitions.

LTCC antenna-in-package solution for millimeter-wave applications

An antenna element suitable for antenna-in-package solutions at millimeter wave frequencies is introduced. The antenna is composed of a circular patch which is fed with a folded SIW feeding network. This feeding network not only makes the array design procedure modular but also reduces the interaction of the antenna and the radio integrated in the final transceiver. LTCC technology has been used to implement the packaging idea.

THz holographic imaging: A spatial-domain technique for phase retrieval and image reconstruction

A method has been introduced for the phase-retrieval step in the field of holographic imaging. In contrary to the phase-retrieval methods available in the literature which are mainly implemented in the wave-number domain the method introduced here retrieves the phase directly in the spatial domain. Although, the method is applicable to holographic imaging at any frequency and wavelength, its validity is investigated at 310 GHz practically. The image quality of a metallic object reconstructed by means of the method introduced confirms the validity and applicability of this method to holographic imaging systems.

Agricultural Applications for Electromagnetic Exposure

Despite the advances in bug controlling and anti-freezing operations of agricultural products, the devastation of Sunne pests and freezing is still enormous. Traditional treatments such as chemical insecticides for bug controlling and covering to avoid freezing have not been sufficient. In the presented paper, new ideas of using electromagnetic treatment for anti-freezing operation, pre-harvest Sunne pest control, and Orchid flower control are introduced.

Pre-harvest annihilation of sunne-pest in winters using electromagnetic exposure

Despite the advances in bug controlling programs, the devastation of sunne pests is still enormous. Traditional treatments such as chemical insecticides had not been sufficient. Therefore, some modern methods, including electromagnetic exposure, are suggested. Almost always, this method has been suggested for post-harvest stored products. In the presented paper, the idea of using electromagnetic treatment for pre-harvest sunne pest control is introduced. In the future, some of the practical results and more precise case studies of this idea will be published.