Ana Peral

Impact of Extended Contact Cofiring on Multicrystalline Silicon Solar Cell Parameters

During the temperature spike of the contact cofiring step in a solar cell process, it has been shown that the concentration of lifetime-killer dissolved metallic impurities increases, while adding an annealing after the spike getters most of the dissolved impurities toward the phosphorus emitter, where they are less detrimental. The contact cofiring temperature profile, including the after-spike annealing, has been called extended contact cofiring, and it has also been proposed as a means to decrease the emitter saturation current density of highly doped emitters, thus benefiting a wide range of materials in terms of detrimental impurity content. The aim of the present work is to determine the effect of performing this additional annealing on contact quality and solar cell performance, looking for an optimal temperature profile for reduction of bulk and emitter recombination without affecting contact quality. It presents the effect of the extended cofiring step on fill factor, series resistance, and contact resistance of solar cells manufactured with different extended cofiring temperature profiles. Fill factor decreases when extended cofiring is performed. Series resistance and contact resistance increase during annealing, and this happens more dramatically when the temperature peak is decreased. Scanning electron microscopic images show silver crystallites in contact with silver bulk before the annealing that allow a direct current path, and silver crystallites totally surrounded by glass layer (>100 nm thick) after annealing. Glass layer redistribution and thickening at low temperatures at the semiconductor-metal interface can be related to the series resistance increase. Degradation of series resistance during the temperature spike, when it is below the optimum one, can also be attributed to an incomplete silicon nitride etching and silver crystallite formation. To make full use of the beneficial effects of annealing, screen-printing metallic paste development supporting lower temperatures without a thick glass layer growth is needed.

Electrically-inactive phosphorus re-distribution during low temperature annealing

An increased total dose of phosphorus (P dose) in the first 40 nm of a phosphorus diffused emitter has been measured after Low Temperature Annealing (LTA) at 700 °C using the Glow Discharge Optical Emission Spectrometry technique. This evidence has been observed in three versions of the same emitter containing different amounts of initial phosphorus. A stepwise chemical etching of a diffused phosphorus emitter has been carried out to prepare the three types of samples. The total P dose in the first 40 nm increases during annealing by 1.4 × 1015 cm–2 for the sample with the highly doped emitter, by 0.8 × 1015 cm–2 in the middle-doped emitter, and by 0.5 × 1015 cm–2 in the lowest-doped emitter. The presence of surface dislocations in the first few nanometers of the phosphorus emitter might play a role as preferential sites of local phosphorus gettering in phosphorus re-distribution, because the phosphorus gettering to the first 40 nm is lower when this region is etched stepwise. This total increase in phosp...

Phosphorus Diffusion Gettering Efficacy in Upgraded Metallurgical-Grade Solar Silicon

In the context of the continuous price reduction in photovoltaics (PV) in recent years, Si feedstock continues to be a relevant component in the cost breakdown of a PV module, highlighting the need for low-cost, low-capital expenditure (CAPEX) silicon technologies to further reduce this cost component. Upgraded metallurgical-grade silicon (UMG Si) has recently received much attention, improving its quality and even attaining, in some cases, solar cell efficiencies similar to those of conventional material. However, some technical challenges still have to be addressed when processing this material to compensate efficiently for the high content of impurities and contaminants. Adaptation of a conventional solar cell process to monocrystalline UMG Si wafers has been studied in this work. In particular, a tailored phosphorus diffusion gettering step followed by a low-temperature anneal at 700°C was implemented, resulting in enhanced bulk lifetime and emitter recombination properties. In spite of the need for further research and material optimization, UMG Si wafers were successfully processed, achieving efficiencies in the range of 15% for a standard laboratory solar cell process with aluminum back surface field.

Thin absorbers for defect-tolerant solar cell design

Thin silicon wafers provide a pathway to lower cost and lower capital intensity PV module manufacturing. They can also produce higher-efficiency devices with less expensive feedstock and crystallization processes because they require shorter diffusion lengths and operate at higher carrier injection. Through simulation, we show that thin Si wafers can be incorporated into high-efficiency cells with greater defect tolerance than thick wafers. Experimentally, we demonstrate the importance of excellent surface passivation to realizing the efficiency potential of thin silicon solar cells and show that such passivation can be achieved in silicon/amorphous silicon heterojunction devices.