André dos Santos Barros

On the Natural Convection in the Columnar to Equiaxed Transition in Directionally Solidified Aluminum-based Binary and Multicomponent Alloys

In order to investigate the effect of natural convection in columnar to equiaxed transition (CET), Al-3.0wt.%Cu and Al-3.0wt.%Cu-5.5wt.%Si alloys ingots were obtained during the transient horizontal directional solidification (THDS). Aiming to analyze the effect of superheat in the formation of the macrostructure in ternary Al-Cu-Si alloy, the experiments were conducted with three superheat temperatures above the liquidus temperature of the ternary alloy. A water-cooled solidification experimental device was used. Continuous temperature measurements were made during solidification at different positions in the casting and the data were automatically acquired. Thermal analysis has been applied to determine the thermal parameters such as growth rate (VL), cooling rate (TR) and temperature gradient (GL), whose values have been interrelated with the CET. The observation of the macrostructures has indicated that the resulting thermosolutal convection combined with superheat seem to favor the transition, which did not occur in a single plane, for all ingots obtained, i.e., it has been seen in a range of positions in ingots. The addition of Si element in binary Al-Cu alloy anticipates the CET. A comparison with experimental results for CET occurrence in different growth directions has been carried out.

Interconnection between microstructure and microhardness of directionally solidified binary Al-6wt.%Cu and multicomponent Al-6wt.%Cu-8wt.%Si alloys

An experimental study has been carried out to evaluate the microstructural and microhardness evolution on the directionally solidified binary Al-Cu and multicomponent Al-Cu-Si alloys and the influence of Si alloying. For this purpose specimens of Al-6wt.%Cu and Al-6wt.%Cu-8wt.%Si alloys were prepared and directionally solidified under transient conditions of heat extraction. A water-cooled horizontal directional solidification device was applied. A comprehensive characterization is performed including experimental dendrite tip growth rates (VL) and cooling rates (TR) by measuring Vickers microhardness (HV), optical microscopy and scanning electron microscopy with microanalysis performed by energy dispersive spectrometry (SEM-EDS). The results show, for both studied alloys, the increasing of TR and VL reduced the primary dendrite arm spacing (l1) increasing the microhardness. Furthermore, the incorporation of Si in Al-6wt.%Cu alloy to form the Al-6wt.%Cu-8wt.%Si alloy influenced significantly the microstructure and consequently the microhardness but did not affect the primary dendritic growth law. An analysis on the formation of the columnar to equiaxed transition (CET) is also performed and the results show that the occurrence of CET is not sharp, i.e., the CET in both cases occurs in a zone rather than in a parallel plane to the chill wall, where both columnar and equiaxed grains are be able to exist.

Influence of upward and horizontal growth direction on microstructure and microhardness of an unsteady-state directionally solidified Al-Cu-Si alloy

In order to analyze the effect of the growth direction on dendrite arm spacing (λ1) and microhardness (HV) during horizontal directional solidification (HDS), experiments were carried out with the Al-3wt.%Cu-5.5wt.%Si alloy and the results compared with others from the literature elaborated for upward directional solidification (UDS). For this purpose, a water-cooled directional solidification experimental device was developed, and the alloy investigated was solidified under unsteady-state heat flow conditions. Thermal parameters such as growth rate (VL) and cooling rate (TR) were determined experimentally and correlations among VL, TR, λ1 and HV has been performed. It is observed that experimental power laws characterize λ1 with a function of VL and TRgiven by: λ1=constant(VL)-1.1 and λ1=constant(TR)-0.55. The horizontal solidification direction has not affected the power growth law of λ1 found for the upward solidification. However, higher values of λ1 have been observed when the solidification is developed in the horizontal direction. The interrelation of HV as function of VL, TR and λ1 has been represented by power and Hall-Petch laws. A comparison with the Al-3wt.%Cu alloy from literature was also performed and the results show the Si element affecting significativaly the HV values.

Thermal Parameters, Tertiary Dendritic Growth and Microhardness of Directionally Solidified Al-3wt%Cu Alloy

The main purpose of this paper is to evaluate both tertiary dendritic arm growth and microhardness of Al-3wt%Cu alloy during horizontal directional solidification under transient heat flow conditions. Experimental thermal profiles recorded during solidification process allowed to determine growth rate and cooling rate values which are associated with both tertiary dendritic arm spacings and microhardness. The results show that initial tertiary branches growth only occurs when a cooling rate value of 1.14 K/s is reached. Variation of tertiary spacings is expressed as-1.1 and-0.55 power law functions of growth rate and cooling rate, respectively. A comparative analysis with other studies published in the literature that analyze tertiary dendritic growth of Al-Cu alloys considering transient directional solidification is carried out. Dependence of microhardness on dendritic arrangement is evaluated by experimental laws of power and Hall-Petch types with a view to permitting the applicability of the resulting expressions.

Unsteady-State Horizontal Solidification of an Al–Si–Cu–Fe Alloy: Relationship Between Thermal Parameters and Microstructure with Mechanical Properties/Fracture Feature

Aluminum casting alloys have properties which are of great industrial interest, such as low density, good corrosion resistance, high thermal and electrical conductivities, good combination of mechanical properties, good workability in machining processes and mechanical forming. Currently, these alloys are produced in various systems and dozens of compositions. In this investigation, a mutual interaction of thermal parameters, scale of the dendritic microstructure, intermetallic compounds (IMCs), microhardness and tensile properties/fracture characteristics of a casting Al–7wt%Si–3wt%Cu–0.3wt%Fe alloy was analyzed. Solidification experiments were developed using a furnace that promoted horizontal growth under transient heat flow conditions. Then, growth rate (VL), cooling rate (CR), and local solidification time (tSL) were determined from measured temperature profiles. Secondary dendritic spacings (λ2), Si particles, Fe-rich and Al2Cu intermetallic phases were characterized by optical and SEM microscopy, as well as the area mapping and point-wise EDS microanalysis. Hence, the interrelations involving Vickers microhardness (HV), yield strength (σYS), ultimate tensile strength (σUTS) and elongation (E%) with microstructural features were evaluated by mathematical equations. IMCs as well as morphologies of Si were also analyzed in the fracture regions. In addition, the experimental growth law of λ2 = f(tSL) proposed in this study was compared with a predictive theoretical model reported in the literature for multicomponent alloys. It was observed that areas that tend to grow faster (lowest λ2 values) were associated with the highest σUTS and E% values, while HV and σYS properties were not affected by the thermal and microstructural parameters (CR and λ2). In addition, less extensive cleavage planes accompanied by small dimples in were observed in fractured samples with lower λ2 values.

Microstructure and microhardness in horizontally solidified Al–7Si–0.15Fe–(3Cu; 0.3Mg) alloys

ABSTRACT Transient horizontal directional solidification (THDS) experiments have been carried out with Al–7wt.%Si–0.15Fe, Al–7wt.%Si–3wt.%Cu–0.15wt.%Fe and Al–7wt.%Si–0.3wt.%Mg–0.15wt.%Fe alloys, to identify experimental relationships between growth rates (GR), cooling rates (CR), tertiary dendrite arm spacings (λ3) and microhardness (HV). Optical microscopy and scanning electron microscopy/energy-dispersive spectrometry (SEM/EDS) were used to perform a comprehensive microstructural characterisation of the β-Al5FeSi, ω-Al7Cu2Fe, θ-Al2Cu, π-Al8Mg3FeSi6 and α-Mg2Si intermetallic phases. The addition of Cu and Mg to the Al–7wt.%Si–0.15wt.%Fe alloy led to the precipitation of ω and π phases from the β phase. It has been found for all analysed alloys that power experimental functions given by λ3 = constant.(GR)-1.1 and λ3 = constant.(CR)-0.55 best describe the variation of λ3 with corresponding thermal and microstructural parameters.

Examination of Thermal Parameters, Primary Dendritic Spacings and Microhardness of a Horizontally Solidified Al-Cu-Mg Ternary Alloy

In this paper, the Al-3wt.%Cu-0.5wt.%Mg alloy was grown by the transient horizontal directional solidification method in a water cooled stainless steel chill. A temperature monitoring system in the metal was used and the registered time-temperature data during the solidification process were applied to determine tip growth rates (VL) and cooling rates (TR) which have been correlated with both primary dendrite arm spacings (λ1) and Vickers microhardness (HV). Characterization techniques by optical and scanning electron microscopy (OM and SEM) were employed and the observed microstructures show an Al-rich dendritic matrix (a-Al) and θ (Al2Cu) and S (Al2CuMg) intermetallic phases within the interdendritic regions. Power and Hall-Petch type experimental equations were proposed to describe the HV profile as a function of the thermal and microstructural parameters (VL, TR, and λ1). In order to investigate the effect of the Mg alloying, a comparative analysis was also performed between the experimental values of this article and the results of previous studies carried out with the Al-3wt.%Cu binary alloy.

Mathematical method to characterize the inward solid state diffusion in cylindrical parts

This work presents an analytical method for the study of the solid state diffusion process in binary systems of two phases with cylindrical radial atomic flux. The method is developed from the differential equation that describes Ficks second law that is modified by geometric function and suitable changes of variables. The modified differential equation is solved by using a well-known closed form solution based on the error function, and then analytical equations are obtained to analyze the diffusion interface position as a function of time, and the concentration profiles as a function of time and position. The predictions provided by the analytical method are compared with numerical results.

Effect of Interfacial Heat Transfer Coefficient on Dendritic Growth and Microhardness during Horizontal Directional Solidification of an Aluminum-Copper Alloy

This paper presents a theoretical-experimental study for the prediction of the interfacial heat transfer coefficient during the horizontal directional solidification of an Al-3wt.%Cu alloy on water cooled stainless steel chill under transient heat flow conditions. Eight thermocouples were connected with the casting and the time-temperature data were recorded automatically. The thermocouples were placed at 5, 10, 15, 20, 30, 50, 70 and 90 mm from the metal-mold interface. A numerical technique which compares theoretical and experimental thermal profiles was used to measure the heat transfer coefficient values. This has permitted the evaluation of the variation of this thermal parameter along the solidification which is represented by a power equation that shows the time dependence during the process given by hi = constant (t)-n, which represents the best fit between the experimental and calculated curves. The obtained results also include the variation of both primary and secondary dendritic arm spacings of alloy analyzed as a function of heat transfer coefficient. These dendrite arm spacings were found to decrease as the values of this coefficient are increased. Finally, an experimental law of the Hall-Petch type is proposed relating the resulting microhardness to the heat transfer coefficient investigated.