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Andrew D. Delano

Hewlett-Packard

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Publication

Featured researches published by Andrew D. Delano.

Archive | 2003

APPARATUS AND METHOD FOR COOLING AN ELECTRONIC DEVICE

Brandon Rubenstein; Andrew D. Delano

Archive | 2000

Heatsink for actively cooled daughterboard system

Sean W. Tucker; Arlen L. Roesner; Darren B Smith; Donald Trotter; Andrew D. Delano

Archive | 2003

Method of assembly of a wedge thermal interface to allow expansion after assembly

Joseph M. Whit; Andrew D. Delano

Archive | 2004

Heat sink fin with stator blade

Andrew D. Delano; Brandon Rubenstein

Archive | 2000

Actively cooled daughterboard system

Sean W. Tucker; Arlen L. Roesner; Darren B Smith; Donald Trotter; Andrew D. Delano

Archive | 2003

VARIABLE HEIGHT THERMAL INTERFACE

Joseph M. White; Andrew D. Delano

Archive | 2003

Variable-wedge thermal-interface device

Andrew D. Delano; Bradley E Clements; Brandon Rubenstein

Archive | 2004

Heat sink device with independent parts

Andrew D. Delano; Bradley E Clements

Archive | 2004

Bolster plate assembly for processor module assembly

Brandon Rubenstein; Andrew D. Delano; Bradley E Clements

Archive | 2006

Heat transfer apparatus and methods

Andrew D. Delano; Christian L. Belady

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Collaboration

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Brandon Rubenstein

Hewlett-Packard

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Bradley E Clements

Hewlett-Packard

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Arlen L. Roesner

Hewlett-Packard

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Darren B Smith

Hewlett-Packard

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Donald Trotter

Hewlett-Packard

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Sean W. Tucker

Hewlett-Packard

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Joseph M. Whit

Hewlett-Packard

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Joseph M. White

Hewlett-Packard

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