Angelo M. Puzella

Technology trends for future low cost phased arrays

The next generation of active electronically scanned arrays (AESAs) is dependent upon many technology and application pulls and the pushes. RF and manufacturing technologies are key elements of achieving more affordable phased arrays in support of both military and commercial applications. Advanced, evolving, mature and even revolutionary device, material and packaging technologies are making significant strides for lowering the cost of phased arrays. To date, phased array usage has been limited to high end military and commercial applications. Thats about to change with the evolution of more affordable AESA architectures that take advantage of RF microelectronics, surface mount RF packaging and new architectures focused on reducing the high cost drivers. New Panel AESA approaches promise a savings of more than 50% since the initial nearly 20 years ago.

Scan impedance for an infinite dipole array: Accurate theoretical model compared to numerical software

A theoretical model of VanKoughnett and Yen to ran infinite planar dipole array has been revised and extended to the case of a finite feeding gap with finite dipole spacing. the model was than compared with results from the Ansoft HFSS v.11 and CST Microwave Studio 2008 numerical antenna array simulators. The agreement among three approaches for the infinite dipole array was generally very good in all scan planes, with the exception of minor differences that can be accounted for. This confirmed both the new analytical model and the numerical simulation data.

Insertion loss for two microstrip ports coupled by proximity slots

A slot-coupled microstrip vertical interconnection was successfully used to interconnect two microstrip lines on two adjacent signal layers. The present study investigates an extension of this method, when two layers are separated by an air gap of a finite thickness h. Such a geometry implies a very short-range wireless link (slot-to-slot magnetic coupling). It may be of interest for high density three-dimensional microwave systems with rapidly replaceable components.