Anpan Han

Sensing protein molecules using nanofabricated pores

We report the detection of protein molecules with nanofabricated pores using the resistive pulse sensing method. A 20-nm-thick silicon nitride membrane with a nanofabricated pore measuring about 55nm in diameter separated an electrolyte cell into two compartments. Current spike trains were observed when bovine serum albumin (BSA) was added to the negatively biased compartment. The magnitude of the spikes corresponded to particles 7–9nm in diameter (the size of a BSA molecule) passing through the pore. This suggests that the current spikes were current blockages caused by single BSA molecules. The presented nano-Coulter counting method could be applied to detect single protein molecules in free solution, and to study the translocation of proteins through a pore.

Label-Free Detection of Single Protein Molecules and Protein-Protein Interactions Using Synthetic Nanopores

Nanofabricated pores in 20 nm-thick silicon nitride membranes were used to probe various protein analytes as well as to perform an antigen-antibody binding assay. A two-compartment electrochemical cell was separated by a single nanopore, 28 nm in diameter. Adding proteins to one compartment caused current perturbations in the ion current flowing through the pore. These perturbations correlated with both the charge and the size of the protein or of a protein-protein complex. The potential of this nanotechnology for studying protein-protein interactions is highlighted with the sensitive detection of beta-human chorionic gonadotropin, a hormone and clinical biomarker of pregnancy, by monitoring in real time and at a molecular level the formation of a complex between hormones and antibodies in solution. In this form, the assay compared advantageously to immunoassays, with the important difference that labels, immobilization, or amplification steps were no longer needed. In conclusion, we present proof-of-principle that properties of proteins and their interactions can be investigated in solution using synthetic nanopores and that these interactions can be exploited to measure protein concentrations accurately.

Nanopatterning on Nonplanar and Fragile Substrates with Ice Resists

Electron beam (e-beam) lithography using polymer resists is an important technology that provides the spatial resolution needed for nanodevice fabrication. But it is often desirable to pattern nonplanar structures on which polymeric resists cannot be reliably applied. Furthermore, fragile substrates, such as free-standing nanotubes or thin films, cannot tolerate the vigorous mechanical scrubbing procedures required to remove all residual traces of the polymer resist. Here we demonstrate several examples where e-beam lithography using an amorphous ice resist eliminates both of these difficulties and enables the fabrication of unique nanoscale device structures in a process we call ice lithography. (1, 2) We demonstrate the fabrication of micro- and nanostructures on the tip of atomic force microscope probes, microcantilevers, transmission electron microscopy grids, and suspended single-walled carbon nanotubes. Our results show that by using amorphous water ice as an e-beam resist, a new generation of nanodevice structures can be fabricated on nonplanar or fragile substrates.

An ice lithography instrument

We describe the design of an instrument that can fully implement a new nanopatterning method called ice lithography, where ice is used as the resist. Water vapor is introduced into a scanning electron microscope (SEM) vacuum chamber above a sample cooled down to 110 K. The vapor condenses, covering the sample with an amorphous layer of ice. To form a lift-off mask, ice is removed by the SEM electron beam (e-beam) guided by an e-beam lithography system. Without breaking vacuum, the sample with the ice mask is then transferred into a metal deposition chamber where metals are deposited by sputtering. The cold sample is then unloaded from the vacuum system and immersed in isopropanol at room temperature. As the ice melts, metal deposited on the ice disperses while the metals deposited on the sample where the ice had been removed by the e-beam remains. The instrument combines a high beam-current thermal field emission SEM fitted with an e-beam lithography system, cryogenic systems, and a high vacuum metal deposition system in a design that optimizes ice lithography for high throughput nanodevice fabrication. The nanoscale capability of the instrument is demonstrated with the fabrication of nanoscale metal lines.

Influence of Ti and Cr Adhesion Layers on Ultrathin Au Films

Efficient adhesion of gold thin films on dielectric or semiconductor substrates is essential in applications and research within plasmonics, metamaterials, 2D materials, and nanoelectronics. As a consequence of the relentless downscaling in nanoscience and technology, the thicknesses of adhesion layer and overlayer have reached tens of nanometers, and it is unclear if our current understanding is sufficient. In this report, we investigated how Cr and Ti adhesion layers influence the nanostructure of 2-20 nm thin Au films by means of high-resolution electron microscopy, complemented with atomic force microscopy and X-ray photoelectron spectroscopy. Pure Au films were compared to Ti/Au and Cr/Au bilayer systems. Both Ti and Cr had a striking impact on grain size and crystal orientation of the Au overlayer, which we interpret as the adhesion layer-enhanced wetting of Au and the formation of chemical bonds between the layers. Ti formed a uniform layer under the Au overlayer. Cr interdiffused with the Au layer forming a Cr-Au alloy. The crystal orientation of the Au layers was mainly [111] for all thin-film systems. The results showed that both adhesion layers were partially oxidized, and oxidation sources were scrutinized and found. A difference in bilayer electrical resistivity between Ti/Au and Cr/Au systems was measured and compared. On the basis of these results, a revised and more detailed adhesion layer model for both Ti/Au and Cr/Au systems was proposed. Finally, the implications of the results were analyzed, and recommendations for the selection of adhesion layers for nano-optics and nanoelectronics applications are presented.

Three-Dimensional in Situ Electron-Beam Lithography Using Water Ice

Three-dimensional (3D) nanofabrication techniques are of paramount importance in nanoscience and nanotechnology because they are prerequisites to realizing complex, compact, and functional 3D nanodevices. Although several 3D nanofabrication methods have been proposed and developed in recent years, it is still a formidable challenge to achieve a balance among resolution, accuracy, simplicity, and adaptability. Here, we propose a 3D nanofabrication method based on electron-beam lithography using ice resists (iEBL) and fabricate 3D nanostructures by stacking layered structures and those with dose-modulated exposure, respectively. The entire process of 3D nanofabrication is realized in one vacuum system by skipping the spin-coating and developing steps required for commonly used resists. This needs far fewer processing steps and is contamination-free compared with conventional methods. With in situ alignment and correction in the iEBL process, a pattern resolution of 20 nm and an alignment error below 100 nm can be steadily achieved. This 3D nanofabrication technique using ice thus shows great potential in the fabrication of complicated 3D nanodevices.