Antony Richard Wilson

Characterization of printed solder paste excess and bridge related defects

Surface mount technology (SMT) involves the printing of solder paste on to printed circuit board (PCB) interconnection pads prior to component placement and reflow soldering. This paper focuses on the solder paste deposition process. With an approximated cause ratio of 50 - 70% of post assembly defects, solder paste deposition represents the most significant cause initiator of the three sub-processes. Paradigmatic cause models, and associated design rules and effects data are extrapolated from academic and industrial literature and formulated into physical models that identify and integrate the process into three discrete solder paste deposition events - i.e. (i) stencil / PCB alignment, (ii) print stroke / aperture filling and (iii) stencil separation / paste transfer. The projectpsilas industrial partners are producers of safety-critical products and have recognised the in-service reliability benefits of electro-mechanical interface elimination when multiple smaller circuit designs are assimilated into one larger printed circuit assembly (PCA). However, increased solder paste deposition related defect rates have been reported with larger PCAs and therefore, print process physical models need to account for size related phenomena.

Current leakage failure of conformally coated electronic assemblies

Conformal coatings are widely used on circuit board assemblies as an attempt to improve reliability and to ensure high insulation impedances, which are for example demanded by low current consumption battery operated RF circuitry. However, components, such as small ceramic capacitors, have occasionally been found to fail in some applications, particularly when covered with a thick silicone conformal coating. This is thought to be due to the diffusion of water through the coating to the capacitor surface where it then combines with solder flux residue, or other organic or ionic contamination left on the components, thereby dramatically increasing the effective component leakage current. The primary objective of this experimental research is therefore to establish a clear understanding of the effects of moisture exposure on the surface insulation resistance (SIR) of conformally coated printed circuit board (PCB) assemblies. This has been achieved through leakage current measurements on multilayer ceramic capacitors during storage in an environmental chamber during testing similar to IPC standards for non-component loaded boards.

A simulation module for supporting the manufacture of high value added electronics manufacturing

Given the global pressures and demanding requirements for high value added electronics manufacturing, it is vital to make the right decisions on the shop floor. One of the main shop floor level decisions in the domain is the selection of the most appropriate scheduling strategy for the available manufacturing system. Simulation has proved to be a powerful decision support tool. However, very few studies have used this potential to support the evaluation of scheduling strategies in a manufacturing context. A component-based simulation tool to evaluate the performance of scheduling strategies on a particular system is presented in this paper. The component based structure of the simulation tool allows the main problem requirements to be addressed. An example, based on a real company, illustrates the nature of the simulation results and the kind of support that can be obtained.

Complex Low Volume Electronics Simulation Tool to Improve Yield and Reliability

Assembly of Printed Circuit Boards (PCB) in low volumes and a high-mix requires a level of manual intervention during product manufacture, which leads to poor first time yield and increased production costs. Failures at the component-level and failures that stem from non-component causes (i.e. system-level), such as defects in design and manufacturing, can account for this poor yield. These factors have not been incorporated in prediction models due to the fact that system-failure causes are not driven by well-characterised deterministic processes. A simulation and analysis support tool being developed that is based on a suite of interacting modular components with well defined functionalities and interfaces is presented in this paper. The CLOVES (Complex Low Volume Electronics Simulation) tool enables the characterisation and dynamic simulation of complete design; manufacturing and business processes (throughout the entire product life cycle) in terms of their propensity to create defects that could cause product failure. Details of this system and how it is being developed to fulfill changing business needs is presented in this paper. Using historical data and knowledge of previous printed circuit assemblies (PCA) design specifications and manufacturing experiences, defect and yield results can be effectively stored and re-applied for future problem solving. For example, past PCA design specifications can be used at design stage to amend designs or define process options to optimise the product yield and service reliability.

Integration issues in the development of a modelling and simulation tool for low volume high-complexity electronics manufacture

In order to design and implement the information systems and modules that could comprise an ldquoindustrial strongrdquo knowledge-based tool, links to shop floor systems containing real-time production data and PCA customer information (e.g. bill of materials (BOM), CAD drawings) are required. Details of the issues of implementing the tool in an industrial organisation and the integration of various data sources (e.g. ldquoin-houserdquo developed systems, enterprise resource planning systems, ad-hoc developed databases, machine data and CAD data) are presented in this paper. The application of the CLOVES system in an industrial setup highlights the difficulties in integrating information from design as CAD data and shows how these setbacks could be overcome if the electronics industry were to adopt a common CAD assembly information exchange platform. Hence, this paper concludes that existing automation tool manufacturers should focus exclusively on developing generic connections by adopting industry standards that can facilitate the deployment of ldquoplug and playrdquo tools. This standardisation could in turn help software developers, to provide the electronics industry with more integrated systems that communicate better among loosely coupled information systems and avoid depending on extensive time consuming manual data input.

Thirty-Second IEEE International Electronics Manufacturing Technology Symposium

The following topics are covered:manufacturing and test technology, materials for electronics packaging, stacked die and die-attach film, imaging, medical technology, embedded technology, materials in packaging applications, materials for interconnects, lead-free soldering and bonding, lead-free soldering and MEMS, nanotechnology, environmental design.