AnYao Liu

Gettering of interstitial iron in silicon by plasma-enhanced chemical vapour deposited silicon nitride films

It is known that the interstitial iron concentration in silicon is reduced after annealing silicon wafers coated with plasma-enhanced chemical vapour deposited (PECVD) silicon nitride films. The underlying mechanism for the significant iron reduction has remained unclear and is investigated in this work. Secondary ion mass spectrometry (SIMS) depth profiling of iron is performed on annealed iron-contaminated single-crystalline silicon wafers passivated with PECVD silicon nitride films. SIMS measurements reveal a high concentration of iron uniformly distributed in the annealed silicon nitride films. This accumulation of iron in the silicon nitride film matches the interstitial iron loss in the silicon bulk. This finding conclusively shows that the interstitial iron is gettered by the silicon nitride films during annealing over a wide temperature range from 250 °C to 900 °C, via a segregation gettering effect. Further experimental evidence is presented to support this finding. Deep-level transient spectrosc...

Contrast enhancement of luminescence images via point-spread deconvolution

We investigate the impact of point-spread in the silicon CCD sensor of a BT Imaging LIS-R1 luminescence imaging system. It is found that an experimental definition of the point-spread function allows for a significant restoration of CCD point-spread to be achieved. A comparison with short-pass filtering is performed, demonstrating that point-spread will still have a measurable influence on image quality while reducing the luminescence signal and increasing the relative noise level. An implementation of point-spread deconvolution is presented at a multi-crystalline silicon grain boundary, illustrating a practical enhancement of resolution in a typical high-contrast scenario. The characteristics of the point-spread presented here are specific to the experimental apparatus investigated, but the procedure described is universally applicable.

Hydrogen passivation of interstitial iron in boron-doped multicrystalline silicon during annealing

Effective hydrogenation of interstitial iron in boron-doped multicrystalline silicon wafers is reported. The multicrystalline silicon wafers were annealed with plasma-enhanced chemical vapour deposited silicon nitride films, at temperatures of 400 °C – 900 °C and for times from minutes to hours. At low temperatures where a combined effect of hydrogenation and precipitation of dissolved Fe is expected, results show that the hydrogenation process dominates the effect of precipitation. The concentrations of dissolved interstitial iron reduce by more than 90% after a 30-min anneal at temperatures between 600 and 900 °C. The most effective reduction occurs at 700 °C, where 99% of the initial dissolved iron is hydrogenated after 30 min. The results show that the observed reductions in interstitial Fe concentrations are not caused by the internal gettering of Fe at structural defects or by an enhanced diffusivity of Fe due to the presence of hydrogen. The hydrogenation process is conjectured to be the pairing of positively charged iron with negatively charged hydrogen, forming less recombination active Fe-H complexes in silicon.

Precipitation of iron in multicrystalline silicon during annealing

In this paper, the precipitation kinetics of iron in multicrystalline silicon during moderate temperature annealing are systematically studied with respect to annealing time, temperature, iron super-saturation level, and different types and densities of precipitation sites. The quantitative analysis is based on examining the changes in the concentrations and distributions of interstitial iron in multicrystalline silicon wafers after annealing at 400–700 °C. This is achieved by using the photoluminescence imaging technique to produce high-resolution spatially resolved images of the interstitial iron concentrations. The concentrations of interstitial iron are found to decrease exponentially with the annealing time. Comparison of the precipitation time constants of wafers annealed at different temperatures and of different initial interstitial iron concentrations indicates that higher levels of iron super-saturation result in faster precipitation processes. The impact of iron super-saturation on the precipit...

Investigating Internal Gettering of Iron at Grain Boundaries in Multicrystalline Silicon via Photoluminescence Imaging

In this paper, we present measurements and modeling of the reduction in dissolved iron Fe; concentrations near grain boundaries in multicrystalline silicon (mc-Si) wafers. The measurements of the interstitial Fe concentrations are obtained via photoluminescence images taken before and after iron-boron pair dissociation. A simple diffusion-capture model was developed to characterize the removal of interstitial Fe by the gettering sites. The model is based on a numerical solution to the 1-D diffusion equation with two fitting parameters: the diffusion length of dissolved Fe atoms and the effective gettering velocity at the gettering site. By comparing the simulation with a controlled phosphorous gettering process, the model is shown to give good estimation of the diffusion length of Fe atoms. For as-cut multicrystalline silicon wafers from different parts of the ingot, that is, wafers with different average dissolved Fe concentrations [Fei], the diffusion lengths of Fe atoms are found to decrease with decreasing average [Fei] This suggests the presence of relaxation precipitation during the internal gettering of dissolved Fe by the grain boundaries in mc-Si during ingot cooling.

External and Internal Gettering of Interstitial Iron in Silicon for Solar Cells

The removal of dissolved iron from the wafer bulk is important for the performance of p-type multicrystalline silicon solar cells. In this paper we review some recent progress in understanding both external and internal gettering of iron. Internal gettering at grain boundaries and dislocations occurs naturally during ingot cooling, and can also be driven further during cell processing, especially by moderate temperature anneals (usually below 700 °C). Internal gettering at intra-grain defects plays key a role during such precipitation annealing. External gettering to phosphorus diffused regions is crucial in reducing the dissolved iron concentration during cell processing, although its effectiveness depends strongly on the diffusion temperature and profile. Gettering of Fe by boron and aluminum diffusions is also found to be very effective under certain conditions.

Impurity gettering effect of atomic layer deposited aluminium oxide films on silicon wafers

We present experimental evidence for the impurity gettering effect of atomic layer deposited aluminium oxide (Al2O3) films on silicon wafers, during typical surface passivation activation at 425 °C. Iron was used as a model impurity in silicon to study the gettering effects. Dissolved iron concentrations were determined by carrier lifetime measurements, allowing the iron loss kinetics in silicon wafers with Al2O3 coatings to be monitored during annealing. The redistribution of iron to the surface layers and the sub-surface regions was examined by secondary ion mass spectrometry depth profiling. The results show that the atomic layer deposited Al2O3 films generate a strong gettering effect, removing 50% of the iron after 30 min at 425 °C for a 160-μm thick silicon wafer. The iron reduction process is largely diffusion-limited in the initial stages. The gettering effect is caused by the accumulation of iron at the Al2O3/Si interface.

Photoluminescence Spectra of Moderately Doped, Compensated Silicon Si:P,B at 79–300 K

Photoluminescence (PL) spectra from moderately doped, compensated silicon with boron and phosphorus concentrations on the order of

Impurity Gettering by Atomic-Layer-Deposited Aluminium Oxide Films on Silicon at Contact Firing Temperatures (Phys. Status Solidi RRL 3/2018)

{\text{10}^{16}} - {\text{10}^{17}}\;{\text{c}}{{\text{m}}^{ - 3}}

Precipitation of Interstitial Iron in Multicrystalline Silicon

, which is representative of the low-cost upgraded metallurgical grade silicon potentially used for photovoltaics, are presented and explained. At 79 K, the captured PL spectra from the compensated silicon reveal the presence of the following radiative recombination channels in the material: band-to-band recombination, recombination through a single neutral dopant (phosphorus or boron), and recombination from the neutral donors (phosphorus) to the neutral acceptors (boron), i.e., the D°–A° pair recombination. The D°–A° pair luminescence peaks are found to appear as rather broad in the measured PL spectra from compensated silicon at 79 K. The relative PL intensity of the broad dopant features is shown to increase with increasing dopant concentrations. The dopant-related luminescence of the compensated silicon demonstrates strong excitation dependence, as a result of the D°–A° recombination channel in compensated silicon. The dopant features become increasingly suppressed at higher excitations due to the increasing dominance of the band-to-band recombination channel. With increasing temperature, the dopant-related luminescence features diminish and become undistinguishable at around 200 K, due to the increased ionization of dopants and the broadening of the band-to-band recombination peaks at higher temperatures.