Arkalgud R. Sitaram

Integrated circuit assemblies with reinforcement frames, and methods of manufacture

Integrated circuits protected by substrates with cavities, and methods of manufacture

Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture

Circuit assemblies with multiple interposer substrates, and methods of fabrication

STRUCTURE AND METHOD FOR INTEGRATED CIRCUITS PACKAGING WITH INCREASED DENSITY

Thermal Vias Disposed in a Substrate Proximate to a Well Thereof

MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSIONS OF CONDUCTIVE VIAS PROTRUDING FROM THROUGH-HOLES PASSING THROUGH SUBSTRATES

INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING

INTERPOSERS AND FABRICATION METHODS THAT USE NANOPARTICLE INKS AND MAGNETIC FIELDS

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies