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Arpit Mittal

Qualcomm

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ieee international d systems integration conference | 2014

Thermal implications of mobile 3D-ICs

Mehdi Saeidi; Kambiz Samadi; Arpit Mittal; Rajat Mittal

In this paper, we introduce a fast and accurate 3D thermal analysis methodology for sequential face-to-back (F2B) and parallel face-to-face (F2F) 3D integration technologies. Our proposed models take design floorplan and the corresponding power map with temperature-dependent leakage power component and accurately estimate the temperature of any given location in the design. We show that our models are within less than 1% of commercial-grade finite-volume models while they are 100X faster. In addition, we demonstrate the minimum power reduction required in mobile 3D-ICs to achieve similar thermal behaviour of that of the corresponding 2D-ICs. Subsequently, we provide guidelines on 3D partitioning / floorplanning to further improve thermal profile of 3D-ICs.

Archive | 2013

Human-body-gesture-based region and volume selection for hmd

Arpit Mittal; Giuliano Maciocci; Michael Luke Tunmer; Paul Mabbutt

Archive | 2015

CALIBRATION OF AUGMENTED REALITY (AR) OPTICAL SEE-THROUGH DISPLAY USING SHAPE-BASED ALIGNMENT

Christopher Pedley; Jonathan David Ward; Arpit Mittal; Giuliano Maciocci

Archive | 2014

THERMAL SIMULATIONS USING CONVOLUTION AND ITERATIVE METHODS

Ryan Michael Coutts; Arpit Mittal; Rajat Mittal; Mohamed Waleed Allam; Mehdi Saeidi

Archive | 2016

PACKAGE-ON-PACKAGE (POP) DEVICE COMPRISING BI-DIRECTIONAL THERMAL ELECTRIC COOLER

Rajat Mittal; Hee Jun Park; Peng Wang; Mehdi Saeidi; Arpit Mittal

Archive | 2015

TECHNIQUES FOR IMPLEMENTING A SYNTHETIC JET TO COOL A DEVICE

Mehdi Saeidi; Arpit Mittal; Emil Rahim; Rajat Mittal; Kambiz Samadi

Archive | 2013

Translation and scale invariant features for gesture recognition

Arpit Mittal

Archive | 2017

CIRCUITS AND METHODS PROVIDING TEMPERATURE MITIGATION FOR COMPUTING DEVICES

Mehdi Saeidi; Arpit Mittal; Farsheed Mahmoudi; Rajat Mittal

Archive | 2017

ENHANCEMENT OF CHIP THERMAL PERFORMANCE THROUGH SILICON THERMAL CONDUCTIVITY MODULATION

Arpit Mittal; Mehdi Saeidi; Kambiz Samadi

Archive | 2017

CIRCUITS AND METHODS PROVIDING TEMPERATURE MITIGATION FOR COMPUTING DEVICES USING ESTIMATED SKIN TEMPERATURE

Arpit Mittal; Mehdi Saeidi; Farsheed Mahmoudi

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