Arturo A. Ayon

Characterization of a Time Multiplexed Inductively Coupled Plasma Etcher

We report the experimentally obtained response surfaces of silicon etching rate, aspect ratio dependent etching (ARDE), photoresist etching rate, and anisotropy parameter in a time multiplexed inductively coupled plasma etcher. The data were collected whi le varying eight etching variables. The relevance of electrode power, pressure, and gas flow rates is presented and has been found t o agree with observations reported in the literature. The observed behavior presented in this report serves as a tool to locate a nd optimize operating conditions to etch high aspect ratio structures. The performance of this deep reactive ion etcher allows the tai loring of silicon etching rates in excess of 4 mm/min with anisotropic profiles, nonuniformities of less than 4% across the wafer, and ARDE control with a depth variation of less than 1 mm for trenches of dissimilar width. Furthermore it is possible to prescribe the slope of etched trenches from positive to reentrant.

Effect of process parameters on the surface morphology and mechanical performance of silicon structures after deep reactive ion etching (DRIE)

The ability to predict and control the influence of process parameters during silicon etching is vital for the success of most MEMS devices. In the case of deep reactive ion etching (DRIE) of silicon substrates, experimental results indicate that etch performance as well as surface morphology and post-etch mechanical behavior have a strong dependence on processing parameters. In order to understand the influence of these parameters, a set of experiments was designed and performed to fully characterize the sensitivity of surface morphology and mechanical behavior of silicon samples produced with different DRIE operating conditions. The designed experiment involved a matrix of 55 silicon wafers with radius hub flexure (RHF) specimens which were etched 10 min under varying DRIE processing conditions. Data collected by interferometry, atomic force microscopy (AFM), profilometry, and scanning electron microscopy (SEM), was used to determine the response of etching performance to operating conditions. The data collected for fracture strength was analyzed and modeled by finite element computation. The data was then fitted to response surfaces to model the dependence of response variables on dry processing conditions.

A six-wafer combustion system for a silicon micro gas turbine engine

As part of a program to develop a micro gas turbine engine capable of producing 10-50 W of electrical power in a package less than one cubic centimeter in volume, we present the design, fabrication, packaging, and experimental test results for the 6-wafer combustion system for a silicon microengine. Comprising the main nonrotating functional components of the engine, the device described measures 2.1 cm/spl times/2.1 cm/spl times/0.38 cm and is largely fabricated by deep reactive ion etching through a total thickness of 3800 /spl mu/m. Complete with a set of fuel plenums, pressure ports, fuel injectors, igniters, fluidic interconnects, and compressor and turbine static airfoils, this structure is the first demonstration of the complete hot flow path of a multilevel micro gas turbine engine. The 0.195 cm/sup 3/ combustion chamber is shown to sustain a stable hydrogen flame over a range of operating mass flows and fuel-air mixture ratios and to produce exit gas temperatures in excess of 1600 K. It also serves as the first experimental demonstration of stable hydrocarbon microcombustion within the structural constraints of silicon. Combined with longevity tests at elevated temperatures for tens of hours, these results demonstrate the viability of a silicon-based combustion system for micro heat engine applications.

Power MEMS and microengines

MIT is developing a MEMS-based gas turbine generator. Based on high speed rotating machinery, this 1 cm diameter by 3 mm thick SiC heat engine is designed to produce 10-20 W of electric power while consuming 10 grams/hr of H/sub 2/. Later versions may produce up to 100 W using hydrocarbon fuels. The combustor is now operating and an 80 W micro-turbine has been fabricated and is being tested. This engine can be considered the first of a new class of MEMS device, power MEMS, which are heat engines operating at power densities similar to those of the best large scale devices made today.

Micro - Heat Engines, Gas Turbines, and Rocket Engines - The MIT Microengine Project -

This is a report on work in progress on microelectrical and mechanical systems (MEMS)-based gas turbine engines, turbogenerators, and rocket engines currently under development at MIT. Fabricated in large numbers in parallel using semiconductor manufacturing techniques, these engines are based on micro-high speed rotating machinery with the same power density as that achieved in their more familiar, full-sized brethren. The micro-gas turbine is a 1 cm diameter by 3 mm thick SiC heat engine designed to produce 10-20 W of electric power or 0.050.1 Nt of thrust while consuming under 10 grams/hr of H 2 . Later versions may produce up to 100 W using hydrocarbon fuels. A liquid fuel, bi-propellant rocket motor of similar size could develop over 3 lb of thrust. The rocket motor would be complete with turbopumps and control valves on the same chip. These devices may enable new concepts in propulsion, fluid control, and por table power generation.

Microfabrication of a high pressure bipropellant rocket engine

A high pressure bipropellant rocket engine has been successfully micromanufactured by fusion bonding a stack of six individually etched single crystal silicon wafers. In order to test the device, an innovative packaging technique was developed to deliver liquid coolant and gaseous propellants to the rocket chip at pressures in excess of 200 atm at temperatures above 300°C. Testing continues on the 1.2 g devices, which have been run to date at a chamber pressure of 12 atm, generating 1 N of thrust, and delivering a thrust power of 750 W.

Stability of self-assembled monolayers on titanium and gold.

Methyl- and hydroxyl-terminated phosphonic acid self-assembled monolayers (SAMs) were coated on Ti from aqueous solution. Dodecyl phosphate and dodecyltrichlorosilane SAMs were also coated on Ti using solution-phase deposition. The stability of SAMs on Ti was investigated in Tris-buffered saline (TBS) at 37 degrees C using X-ray photoelectron spectroscopy, contact angle goniometry, and atomic force microscopy. For comparison purposes, a hydroxyl-terminated thiol SAM was coated on Au, and its stability was also investigated under similar conditions. In TBS, a significant proportion of phosphonic acid or phosphate molecules were desorbed from the Ti surface within 1 day, while the trichlorosilane SAM on Ti or thiol SAM on Au was stable for up to 7 days under similar conditions. The stability of hydroxyl-terminated phosphonic acid SAM coated Ti and thiol SAM coated Au was investigated in ambient air and ultraviolet (UV) light. In ambient air, the phosphonic acid SAM on Ti was stable for up to 14 days, while the thiol SAM on Au was not stable for 1 day. Under UV-radiation exposure, the alkyl chains of the phosphonic acid SAM were decomposed, leaving only the phosphonate groups on the Ti surface after 12 h. Under similar conditions, decomposition of alkyl chains of the thiol SAM was observed on the Au surface accompanied by oxidation of thiolates.

Drug delivery from gold and titanium surfaces using self-assembled monolayers.

Currently available drug-eluting stents (DES) use polymers for coating and releasing drugs. Increasing evidence suggests that inflammatory and hypersensitive reactions are caused by such polymer coatings. This study focused on developing new techniques for delivering drugs directly from metal implant surfaces. Hydroxyl-terminated self-assembled monolayers (SAMs) were coated on Au and Ti surfaces. Therapeutic self-assembled monolayers (TSAMs) were prepared by chemically attaching the model drug, flufenamic acid, to SAM coated metal surfaces. Three different methods of esterification (acid chloride esterification, dry heat esterification, and direct esterification) were explored to attach flufenamic acid to SAMs. TSAMs were characterized using X-ray photoelectron spectroscopy, fluorescence microscopy, atomic force microscopy, and contact angle goniometry. These techniques collectively confirmed the attachment of drug onto SAM coated metal surfaces. In vitro drug release was investigated by immersing TSAM coated metal specimens in tris-buffered saline (TBS) at 37 degrees C for 28 days. TBS was analyzed at 1, 3, 7, 14, 21, and 28 days for the amount of drug eluted using high performance liquid chromatography. Large data scatter was observed for the release profiles of TSAMs prepared by acid chloride esterification. TSAMs prepared by dry heat and direct esterification methods showed an initial burst release of the drug followed by a sustained slow release for up to 2 weeks. Thus, this study suggests the potential for using self-assembled monolayers as an alternate system for delivering drugs from coronary stents and other metal implants.

High Efficiency Hybrid Silicon Nanopillar–Polymer Solar Cells

Recently, inorganic/organic hybrid solar cells have been considered as a viable alternative for low-cost photovoltaic devices because the Schottky junction between inorganic and organic materials can be formed employing low temperature processing methods. We present an efficient hybrid solar cell based on highly ordered silicon nanopillars (SiNPs) and poly(3,4-ethylene-dioxythiophene):polystyrenesulfonate (PEDOT:PSS). The proposed device is formed by spin coating the organic polymer PEDOT:PSS on a SiNP array fabricated using metal assisted electroless chemical etching process. The characteristics of the hybrid solar cells are investigated as a function of SiNP height. A maximum power conversion efficiency (PCE) of 9.65% has been achieved for an optimized SiNP array hybrid solar cell with nanopillar height of 400 nm, despite the absence of a back surface field enhancement. The effect of an ultrathin atomic layer deposition (ALD), grown aluminum oxide (Al2O3), as a passivation layer (recombination barrier) has also been studied for the enhanced electrical performance of the device. With the inclusion of the ultrathin ALD deposited Al2O3 between the SiNP array textured surface and the PEDOT:PSS layer, the PCE of the fabricated device was observed to increase to 10.56%, which is ∼10% greater than the corresponding device without the Al2O3 layer. The device described herein is considered to be promising toward the realization of a low-cost, high-efficiency inorganic/organic hybrid solar cell.

Microfabrication of high-temperature silicon devices using wafer bonding and deep reactive ion etching

As part of an effort to develop a micro gas turbine engine capable of providing 10-50 W of electrical power in a package less than one cubic centimeter in volume, we report the fabrication and testing of the first hydrogen combustor micromachined from silicon. Measuring 0.066 cm/sup 3/ in volume, and complete with a fuel manifold and set of fuel injector holes, the fabrication of the device was largely enabled by the use of deep reactive ion etching (DRIE) and aligned silicon wafer bonding. The 150-W microcombustor has a power density in excess of 2000 MW/m/sup 3/ and has been successfully demonstrated to provide turbine inlet temperatures up to 1800 K. After 15 h of experimental tests, the combustor maintained its mechanical integrity and did not exhibit any visible damage. Combined with the results of a materials oxidation study, these tests are used to demonstrate the satisfactory performance of silicon in the harsh oxidizing environment of a combustion chamber.