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Dive into the research topics where Arunava Majumdar is active.

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Featured researches published by Arunava Majumdar.


Science | 2006

Solid state thermal rectifier

Chih-Wei Chang; Arunava Majumdar; Alex Zettl

We demonstrated nanoscale solid-state thermal rectification. High-thermal-conductivity carbon and boron nitride nanotubes were mass-loaded externally and inhomogeneously with heavy molecules. The resulting nanoscale system yields asymmetric axial thermal conductance with greater heat flow in the direction of decreasing mass density. The effect cannot be explained by ordinary perturbative wave theories, and instead we suggest that solitons may be responsible for the phenomenon. Considering the important role of electrical rectifiers (diodes) in electronics, thermal rectifiers have substantial implications for diverse thermal management problems, ranging from nanoscale calorimeters to microelectronic processors to macroscopic refrigerators and energy-saving buildings.


Journal of Heat Transfer-transactions of The Asme | 2003

Measuring Thermal and Thermoelectric Properties of One-Dimensional Nanostructures Using a Microfabricated Device

Li Shi; Deyu Li; Choongho Yu; Wanyoung Jang; Dohyung Kim; Zhen Yao; Philip Kim; Arunava Majumdar

We have batch-fabricated a microdevice consisting of two adjacent symmetric silicon nitride membranes suspended by long silicon nitride beams for measuring thermophysical properties of one-dimensional manostructures (nanotubes, nanowires, and mmobelts) bridging the two membranes. A platinum resistance heater/thermometer is fabricated on each membrane. One membrane can be Joule heated to cause heat conduction through the sample to the other membrane. Thermal conductance, electrical conductance, and Seebeck coefficient can be measured using this microdevice in the temperature range of 4-400 K of an evacuated Helium cryostat. Measurement sensitivity, errors, and uncertainty are discussed. Measurement results of a 148 nm and a 10 nm-diameter single wall carbon nanotube bundle are presented.


Journal of Heat Transfer-transactions of The Asme | 2001

Monte Carlo Study of Phonon Transport in Solid Thin Films Including Dispersion and Polarization

Sandip Mazumder; Arunava Majumdar

The Boltzmann Transport Equation (BTE) for phonons best describes the heat flow in solid nonmetallic thin films. The BTE, in its most general form, however, is difficult to solve analytically or even numerically using deterministic approaches. Past research has enabled its solution by neglecting important effects such as dispersion and interactions between the longitudinal and transverse polarizations of phonon propagation. In this article, a comprehensive Monte Carlo solution technique of the BTE is presented. The method accounts for dual polarizations of phonon propagation, and non-linear dispersion relationships. Scattering by various mechanisms is treated individually. Transition between the two polarization branches, and creation and destruction of phonons due to scattering is taken into account. The code has been verified and evaluated by close examination of its ability or failure to capture various regimes of phonon transport ranging from diffusive to the ballistic limit. Validation results show close agreement with experimental data for silicon thin films with and without doping. Simulation results show that above 100 K, transverse acoustic phonons are the primary carriers of energy in silicon.


IEEE\/ASME Journal of Microelectromechanical Systems | 2002

Optomechanical uncooled infrared imaging system: design, microfabrication, and performance

Yang Zhao; Minyao Mao; Roberto Horowitz; Arunava Majumdar; J. B. Varesi; Paul R. Norton; John Kitching

This paper presents the design, fabrication and performance of an uncooled micro-optomechanical infrared (IR) imaging system consisting of a focal-plane array (FPA) containing bi-material cantilever pixels made of silicon nitride (SiNx) and gold (Au), which serve as infrared absorbers and thermomechanical transducers. Based on wave optics, a visible optical readout system is designed to simultaneously measure the deflections of all the cantilever beams in the FPA and project the visible deflection map onto a visible charge-coupled device (CCD) imager. The IR imaging results suggest that the detection resolution of current design is 3-5 K, whereas noise analysis indicates the current resolution to be around 1 K. The noise analysis also shows that the theoretical noise-equivalent temperature difference (NETD) of the system can be below 3 mK.


Journal of Heat Transfer-transactions of The Asme | 2002

Thermal Transport Mechanisms at Nanoscale Point Contacts

Li Shi; Arunava Majumdar

We have experimentally investigated the heat transfer mechanisms at a 90±10 nm diameter point contact between a sample and a probe tip of a scanning thermal microscope (SThM). For large heated regions on the sample, air conduction is the dominant tip-sample heat transfer mechanism. For micro/nano devices with a submicron localized heated region, the air conduction contribution decreases, whereas conduction through the solid-solid contact and a liquid meniscus bridging the tip-sample junction become important, resulting in the sub-100 nm spatial resolution found in the SThM images. Using a one dimensional heat transfer model, we extracted from experimental data a liquid film thermal conductance of 6.7±1.5 nW/K. Solid-solid conduction increased linearly as contact force increased, with a contact conductance of 0.76±0.38 W/m 2 -K-Pa, and saturated for contact forces larger than 38±11 nN. This is most likely due to the elastic-plastic contact between the sample and an asperity at the tip end


Applied Physics Letters | 2000

Scanning thermal microscopy of carbon nanotubes using batch-fabricated probes

Li Shi; Sergei Plyasunov; Adrian Bachtold; Paul L. McEuen; Arunava Majumdar

We have designed and batch-fabricated thin-film thermocouple cantilever probes for scanning thermal microscopy (SThM). Here, we report the use of these probes for imaging the phonon temperature distribution of electrically heated carbon-nanotube (CN) circuits. The SThM images reveal possible heat dissipation mechanisms in CN circuits. The experiments also demonstrate that heat flow through the tip-sample nanoscale junction under ambient conditions is dominated by conduction through a liquid film bridging the two surfaces. With the spatial resolution limited by tip radius to about 50 nm, SThM now offers the promising prospects of studying electron-phonon interactions and phonon transport in low dimensional nanostructures.


Langmuir | 2008

Evolutionary Screening of Biomimetic Coatings for Selective Detection of Explosives

Justyn Jaworski; Digvijay Raorane; Jin H. Huh; Arunava Majumdar; Seung-Wuk Lee

Susceptibility of chemical sensors to false positive signals remains a common drawback due to insufficient sensor coating selectivity. By mimicking biology, we have demonstrated the use of sequence-specific biopolymers to generate highly selective receptors for trinitrotoluene and 2,4-dinitrotoluene. Using mutational analysis, we show that the identified binding peptides recognize the target substrate through multivalent binding with key side chain amino acid elements. Additionally, our peptide-based receptors embedded in a hydrogel show selective binding to target molecules in the gas phase. These experiments demonstrate the technique of receptor screening in liquid to be translated to selective gas-phase target binding, potentially impacting the design of a new class of sensor coatings.


IEEE\/ASME Journal of Microelectromechanical Systems | 2001

Design and batch fabrication of probes for sub-100 nm scanning thermal microscopy

Li Shi; Ohmyoung Kwon; Andrew Miner; Arunava Majumdar

A batch fabrication process has been developed for making cantilever probes for scanning thermal microscopy (SThM) with spatial resolution in the sub-100 nm range. A heat transfer model was developed to optimize the thermal design of the probes. Low thermal conductivity silicon dioxide and silicon nitride were chosen for fabricating the probe tips and cantilevers, respectively, in order to minimize heat loss from the sample to the probe and to improve temperature measurement accuracy and spatial resolution. An etch process was developed for making silicon dioxide tips with tip radius as small as 20 nm. A thin film thermocouple junction was fabricated at the tip end with a junction height that could be controlled in the range of 100-600 nm. These thermal probes have been used extensively for thermal imaging of micro- and nano-electronic devices with a spatial resolution of 50 nm. This paper presents measurement results of the steady state and dynamic temperature responses of the thermal probes and examines the wear characteristics of the probes.


Applied Physics Letters | 1999

Thermoelectromechanical refrigeration based on transient thermoelectric effects

A. Miner; Arunava Majumdar; U. Ghoshal

This letter introduces the concept of a thermoelectromechanical cooler (TEMC), which modifies a traditional thermoelectric cooler (TEC) by using intermittent contact of a mechanical element synchronized with an applied pulsed current. Using Bi2Te3 as the thermoelectric material, it is predicted that the maximum temperature drop across a TEMC operated under zero applied heat flux is about 35% higher than that of a TEC. This effectively increases the thermoelectric figure of merit for maximum temperature differential applications by a factor of 1.8.


IEEE\/ASME Journal of Microelectromechanical Systems | 2005

Design and fabrication of a novel bimorph microoptomechanical sensor

Si-Hyung Lim; Jongeun Choi; Roberto Horowitz; Arunava Majumdar

We have designed a so-called flip-over bimaterial (FOB) beam to increase the sensitivity of micromechanical structures for sensing temperature and surface stress changes. The FOB beam has a configuration such that a material layer coats the top and bottom of the second material at different regions along the beam length. By multiple interconnections of FOB beams, the deflection or sensitivity can be amplified, and the out-of-plane motion of a sensing structure can be achieved. The FOB beam has 53% higher thermomechanical sensitivity than a conventional one. Using the FOB beam design, we have developed a microoptomechanical sensor having a symmetric structure such that beam deflection is converted into a linear displacement of a reflecting surface, which is used for optical interferometry. The designed sensor has been fabricated by surface micromachining techniques using a transparent quartz substrate for optical measurement. Within a sensor area of 100 /spl mu/m/spl times/100 /spl mu/m, the thermomechanical sensitivity S/sub T/=180 nm/K was experimentally obtained.

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Li Shi

University of Texas at Austin

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Yang Zhao

University of California

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Deyu Li

Vanderbilt University

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Alex Zettl

University of California

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