Asegun Henry
Georgia Institute of Technology
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Publication
Featured researches published by Asegun Henry.
Nature Nanotechnology | 2014
Virendra Singh; Thomas L. Bougher; Annie Weathers; Ye Cai; Kedong Bi; Michael T. Pettes; Sally A. McMenamin; Wei Lv; Daniel P. Resler; Todd R. Gattuso; David H. Altman; Kenneth H. Sandhage; Li Shi; Asegun Henry; Baratunde A. Cola
Polymers are usually considered thermal insulators, because the amorphous arrangement of the molecular chains reduces the mean free path of heat-conducting phonons. The most common method to increase thermal conductivity is to draw polymeric fibres, which increases chain alignment and crystallinity, but creates a material that currently has limited thermal applications. Here we show that pure polythiophene nanofibres can have a thermal conductivity up to ∼ 4.4 W m(-1) K(-1) (more than 20 times higher than the bulk polymer value) while remaining amorphous. This enhancement results from significant molecular chain orientation along the fibre axis that is obtained during electropolymerization using nanoscale templates. Thermal conductivity data suggest that, unlike in drawn crystalline fibres, in our fibres the dominant phonon-scattering process at room temperature is still related to structural disorder. Using vertically aligned arrays of nanofibres, we demonstrate effective heat transfer at critical contacts in electronic devices operating under high-power conditions at 200 °C over numerous cycles.
Applied Physics Letters | 2011
Zhiting Tian; Keivan Esfarjani; Junichiro Shiomi; Asegun Henry; Gang Chen
The contribution of optical phonons to thermal conductivity has typically been ignored. However, when the system size decreases to the nanoscale regime, optical phonons are no longer negligible. In this study, the contributions of different phonon polarizations to the thermal conductivity of silicon are discussed based on the phonon lifetimes extracted from a first principles approach. The results indicate that around room temperature, optical phonons can contribute over 20% to the thermal conductivity of nanostructures as compared to 5% in bulk materials. In addition, the temperature and size dependence of the contributions from acoustic and optical phonons are fully explored.
Journal of Applied Physics | 2011
Tengfei Luo; Keivan Esfarjani; Junichiro Shiomi; Asegun Henry; Gang Chen
Heat transfer across thermal interface materials is a critical issue for microelectronics thermal management. Polydimethylsiloxane (PDMS), one of the most important components of thermal interface materials presents a large barrier for heat flow due to its low thermal conductivity. In this paper, we use molecular dynamics simulations to identify the upper limit of the PDMS thermal conductivity by studying thermal transport in single PDMS chains with different lengths. We found that even individual molecular chains had low thermal conductivities (κ ∼ 7 W/mK), which is attributed to the chain segment disordering. Studies on double chain and crystalline structures reveal that the structure influences thermal transport due to inter-chain phonon scatterings and suppression of acoustic phonon modes. We also simulated amorphous bulk PDMS to identify the lower bound of PDMS thermal conductivity and found the low thermal conductivity (κ ∼ 0.2 W/mK) is mainly due to the inefficient transport mechanism through exten...
Nature Methods | 2016
Zheng Liu; Yang Liu; Yuan Chang; Hamid Reza Seyf; Asegun Henry; Alexa L. Mattheyses; Kevin Yehl; Yun Zhang; Zhuangqun Huang; Khalid Salaita
To control receptor tension optically at the cell surface, we developed an approach involving optomechanical actuator nanoparticles that are controlled with near-infrared light. Illumination leads to particle collapse, delivering piconewton forces to specific cell surface receptors with high spatial and temporal resolution. We demonstrate optomechanical actuation by controlling integrin-based focal adhesion formation, cell protrusion and migration, and T cell receptor activation.
New Journal of Physics | 2016
Wei Lv; Asegun Henry
We derived a new method for direct calculation of the modal contributions to thermal conductivity, which is termed Green–Kubo modal analysis (GKMA). The GKMA method combines the lattice dynamics formalism with the Green–Kubo formula for thermal conductivity, such that the thermal conductivity becomes a direct summation of modal contributions, where one need not define the phonon velocity. As a result, the GKMA method can be applied to any material/group of atoms, where the atoms vibrate around stable equilibrium positions, which includes non-stoichiometric compounds, random alloys, amorphous materials and even rigid molecules. By using molecular dynamics simulations to obtain the time history of each modes contribution to the heat current, one naturally includes anharmonicity to full order and can obtain insight into the interactions between different modes through the cross-correlations. As an example, we applied the GMKA method to crystalline and amorphous silicon. The modal contributions at each frequency result from the analysis and thereby allow one to apply a quantum correction to the mode heat capacity to determine the temperature dependence of thermal conductivity. The predicted temperature dependent thermal conductivity for amorphous silicon shows the best agreement with experiments to date. The GKMA method provides new insight into the nature of phonon transport, as it casts the problem in terms of mode–mode correlation instead of scattering, and provides a general unified formalism that can be used to understand phonon–phonon interactions in essentially any class of materials or structures where the atoms vibrate around stable equilibrium sites.
Journal of Computational and Theoretical Nanoscience | 2015
Nuo Yang; Tengfei Luo; Keivan Esfarjani; Asegun Henry; Zhiting Tian; Junichiro Shiomi; Yann Chalopin; Baowen Li; Gang Chen
The thermal interface conductance between Al and Si was simulated by a non-equilibrium molecular dynamics method. In the simulations, the coupling between electrons and phonons in Al are considered by using a stochastic force. The results show the size dependence of the interface thermal conductance and the effect of electron-phonon coupling on the interface thermal conductance. To understand the mechanism of interface resistance, the vibration power spectra are calculated. We find that the atomic level disorder near the interface is an important aspect of interfacial phonon transport, which leads to a modification of the phonon states near the interface. There, the vibrational spectrum near the interface greatly differs from the bulk. This change in the vibrational spectrum affects the results predicted by AMM and DMM theories and indicates new physics is involved with phonon transport across interfaces. Keywords:
Scientific Reports | 2016
Kiarash Gordiz; Asegun Henry
We studied the modal contributions to heat conduction at crystalline Si and crystalline Ge interfaces and found that more than 15% of the interface conductance arises from less than 0.1% of the modes in the structure. Using the recently developed interface conductance modal analysis (ICMA) method along with a new complimentary methodology, we mapped the correlations between modes, which revealed that a small group of interfacial modes, which exist between 12–13 THz, exhibit extremely strong correlation with other modes in the system. It is found that these interfacial modes (e.g., modes with large eigen vectors for interfacial atoms) are enabled by the degree of anharmonicity near the interface, which is higher than in the bulk, and therefore allows this small group of modes to couple to all others. The analysis sheds light on the nature of localized vibrations at interfaces and can be enlightening for other investigations of localization.
Energy and Environmental Science | 2014
Asegun Henry; Ravi Prasher
The primary challenges in making renewable energy competitive with fossil fuels for utility scale electricity are to reduce the levelized cost and enable dispatchable power delivery. In this respect concentrated solar power (CSP) with thermal storage could play an important role, since the cost of thermal storage is lower than that of electrochemical batteries. CSP, however, is still expensive and a number of ongoing research efforts are targeted at reducing the cost via a number of technological development pathways. Here, we present a simplified cost model for CSP and show that increasing the temperature of the heat delivered to the power cycle is a potential pathway to reduce the cost. We also propose that solid state energy converters, possibly in combination with traditional turbines, provide additional advantages that can enable high temperature CSP systems with a lower levelized cost of electricity.
Applied Physics Letters | 2016
Wei Lv; Asegun Henry
Amorphous carbon (a-C) is an important material often used in microelectronics. Using a recently developed approach, termed Green–Kubo modal analysis, we were able to calculate the thermal conductivity of a-C, which yielded excellent agreement with experiments, by employing a simple correction to the specific heat. The results show that the heat capacity substantially limits the thermal conductivity of a-C at room temperature and it is dominated by contributions from diffusons between 10 and 40 THz. Furthermore, the phonon relaxation times in a-C do not vary significantly with increasing temperature, which is quite unusual by comparison with the behavior observed for other materials.
Nature | 2017
C. Amy; D. Budenstein; M. Bagepalli; D. England; F. DeAngelis; G. Wilk; Colby Jarrett; C. Kelsall; J. Hirschey; H. Wen; A. Chavan; B. Gilleland; Cansheng Yuan; William C. Chueh; Kenneth H. Sandhage; Yoshiaki Kawajiri; Asegun Henry
Heat is fundamental to power generation and many industrial processes, and is most useful at high temperatures because it can be converted more efficiently to other types of energy. However, efficient transportation, storage and conversion of heat at extreme temperatures (more than about 1,300 kelvin) is impractical for many applications. Liquid metals can be very effective media for transferring heat at high temperatures, but liquid-metal pumping has been limited by the corrosion of metal infrastructures. Here we demonstrate a ceramic, mechanical pump that can be used to continuously circulate liquid tin at temperatures of around 1,473–1,673 kelvin. Our approach to liquid-metal pumping is enabled by the use of ceramics for the mechanical and sealing components, but owing to the brittle nature of ceramics their use requires careful engineering. Our set-up enables effective heat transfer using a liquid at previously unattainable temperatures, and could be used for thermal storage and transport, electric power production, and chemical or materials processing.